Invention Grant
US08552123B2 Thermosetting resin, composition including the same, and printed board fabricated using the same
有权
热固性树脂,包含其的组合物和使用其制造的印刷电路板
- Patent Title: Thermosetting resin, composition including the same, and printed board fabricated using the same
- Patent Title (中): 热固性树脂,包含其的组合物和使用其制造的印刷电路板
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Application No.: US12859425Application Date: 2010-08-19
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Publication No.: US08552123B2Publication Date: 2013-10-08
- Inventor: Jae-Jun Lee , Myung-Sup Jung
- Applicant: Jae-Jun Lee , Myung-Sup Jung
- Applicant Address: KR KR KR
- Assignee: Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.
- Current Assignee Address: KR KR KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2010-0026312 20100324
- Main IPC: C08G63/00
- IPC: C08G63/00

Abstract:
A thermosetting resin including at least one repeating unit represented by the following Chemical Formula 1: wherein, in Chemical Formula 1, A is derived from a phenolic moiety, an anilinic moiety, or a combination thereof, L is C(O)O, C(O)NR′ wherein R′ is hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C6 to C30 aryloxy group, an aromatic ester, an aromatic ester-imide, an aromatic ester-amide, an aromatic amide, or a combination thereof, Z is a substituted or unsubstituted aliphatic group including a double bond or a triple bond, a substituted or unsubstituted alicyclic group including a double bond or a triple bond, a substituted or unsubstituted aryl group including a double bond or a triple bond, (iso)cyanate, a derivative thereof, or a combination thereof, and n is an integer ranging from 1 to about 4.
Public/Granted literature
- US20110236701A1 THERMOSETTING RESIN, COMPOSITION INCLUDING THE SAME, AND PRINTED BOARD FABRICATED USING THE SAME Public/Granted day:2011-09-29
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