- 专利标题： Electronic devices with yielding substrates
-
申请号： US13751563申请日： 2013-01-28
-
公开(公告)号： US08552463B2公开(公告)日： 2013-10-08
- 发明人: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- 申请人： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- 申请人地址： CA Burnaby
- 专利权人： Cooledge Lighting Inc.
- 当前专利权人： Cooledge Lighting Inc.
- 当前专利权人地址： CA Burnaby
- 代理机构： Bingham McCutchen LLP
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/00
摘要：
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
公开/授权文献
- US20130181238A1 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES 公开/授权日：2013-07-18
信息查询
IPC分类:
