Invention Grant
- Patent Title: Diaphragm of MEMS electroacoustic transducer
- Patent Title (中): MEMS电声换能器的隔膜
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Application No.: US13665935Application Date: 2012-11-01
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Publication No.: US08553911B2Publication Date: 2013-10-08
- Inventor: Li-Che Chen
- Applicant: United Microelectronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agent Ding Yu Tan
- Main IPC: H04R7/02
- IPC: H04R7/02
Abstract:
A diaphragm of an MEMS electroacoustic transducer including a first axis-symmetrical pattern layer is provided. Because the layout of the first axis-symmetrical pattern layer can match the pattern of the sound wave, the vibration uniformity of the diaphragm can be improved.
Public/Granted literature
- US20130056297A1 DIAPHRAGM OF MEMS ELECTROACOUSTIC TRANSDUCER Public/Granted day:2013-03-07
Information query
