Invention Grant
- Patent Title: Fluid interconnect for fluid ejection system
- Patent Title (中): 用于流体喷射系统的流体互连
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Application No.: US13126899Application Date: 2008-10-30
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Publication No.: US08556399B2Publication Date: 2013-10-15
- Inventor: Marjan S. Amesbury , Mark A. Smith
- Applicant: Marjan S. Amesbury , Mark A. Smith
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2008/081784 WO 20081030
- International Announcement: WO2010/050954 WO 20100506
- Main IPC: B41J2/175
- IPC: B41J2/175
Abstract:
A fluid interconnect for a fluid ejection system includes a fluid port having a fluid passage formed therethrough, and a filter provided at an end of the fluid port such that fluid passing through the fluid port passes through the filter to the fluid passage, wherein the filter is secured to an end surface and a peripheral surface of the fluid port.
Public/Granted literature
- US20110228022A1 FLUID INTERCONNECT FOR FLUID EJECTION SYSTEM Public/Granted day:2011-09-22
Information query
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