发明授权
US08557616B2 Method for manufacturing a monolithic LED micro-display on an active matrix panel using flip-chip technology and display apparatus having the monolithic LED micro-display
有权
使用倒装芯片技术在有源矩阵面板上制造单片LED微型显示器的方法和具有单片LED微型显示器的显示装置
- 专利标题： Method for manufacturing a monolithic LED micro-display on an active matrix panel using flip-chip technology and display apparatus having the monolithic LED micro-display
- 专利标题（中）： 使用倒装芯片技术在有源矩阵面板上制造单片LED微型显示器的方法和具有单片LED微型显示器的显示装置
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申请号： US13130442申请日： 2010-06-01
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公开(公告)号： US08557616B2公开(公告)日： 2013-10-15
- 发明人: Kei May Lau , Chi Wing Keung , Zhaojun Liu
- 申请人： Kei May Lau , Chi Wing Keung , Zhaojun Liu
- 申请人地址： CH Hong Kong
- 专利权人： Nano and Advanced Materials Institute Limited
- 当前专利权人： Nano and Advanced Materials Institute Limited
- 当前专利权人地址： CH Hong Kong
- 代理机构： Nath, Goldberg & Meyer
- 代理商 Jerald L. Meyer; Stanley N. Protigal
- 国际申请： PCT/US2010/036900 WO 20100601
- 国际公布： WO2011/071559 WO 20110616
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the CMOS process can be eliminated.