公开(公告)号：US20110309378A1

公开(公告)日：2011-12-22

申请号：US13130442

申请日：2010-06-01

申请人： Kei May Lau ,  Chi Wing Keung ,  Zhaojun Liu

发明人： Kei May Lau ,  Chi Wing Keung ,  Zhaojun Liu

IPC分类号： H01L33/62

CPC分类号： H01L33/08 ,  H01L27/1214 ,  H01L27/1225 ,  H01L27/156 ,  H01L33/40

摘要： A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the CMOS process can be eliminated.

摘要翻译： 使用倒装芯片技术制造了高分辨率，有源矩阵（AM）编程单片发光二极管（LED）微阵列。 制造工艺包括LED微阵列和AM面板的制造，并使用倒装芯片技术组合所得到的LED微阵列和AM面板。 LED微阵列在蓝宝石衬底上生长和制造，AM面板可以使用CMOS工艺制造。 同一行中的LED像素共享连接到AM面板的地面的公共N总线，而LED像素的p电极被电分离，使得每个p电极独立地连接到安装在驱动电路上的驱动电路的输出 AM面板。 LED微阵列被倒装贴合到AM面板上，使得AM面板分别控制LED像素，并且LED像素表现出优异的发射均匀性。 根据该结构，可以消除LED工艺与CMOS工艺之间的不兼容性。

公开(公告)号：US08557616B2

公开(公告)日：2013-10-15

申请号：US13130442

申请日：2010-06-01

申请人： Kei May Lau ,  Chi Wing Keung ,  Zhaojun Liu

发明人： Kei May Lau ,  Chi Wing Keung ,  Zhaojun Liu

IPC分类号： H01L21/00

CPC分类号： H01L33/08 ,  H01L27/1214 ,  H01L27/1225 ,  H01L27/156 ,  H01L33/40

摘要： A high-resolution, Active Matrix (AM) programmed monolithic Light Emitting Diode (LED) micro-array is fabricated using flip-chip technology. The fabrication process includes fabrications of an LED micro-array and an AM panel, and combining the resulting LED micro-array and AM panel using the flip-chip technology. The LED micro-array is grown and fabricated on a sapphire substrate and the AM panel can be fabricated using CMOS process. LED pixels in a same row share a common N-bus line that is connected to the ground of AM panel while p-electrodes of the LED pixels are electrically separated such that each p-electrode is independently connected to an output of drive circuits mounted on the AM panel. The LED micro-array is flip-chip bonded to the AM panel so that the AM panel controls the LED pixels individually and the LED pixels exhibit excellent emission uniformity. According to this constitution, incompatibility between the LED process and the CMOS process can be eliminated.

摘要翻译： 使用倒装芯片技术制造了高分辨率，有源矩阵（AM）编程单片发光二极管（LED）微阵列。 制造工艺包括LED微阵列和AM面板的制造，并使用倒装芯片技术组合所得到的LED微阵列和AM面板。 LED微阵列在蓝宝石衬底上生长和制造，AM面板可以使用CMOS工艺制造。 同一行中的LED像素共享连接到AM面板的地面的公共N总线，而LED像素的p电极被电分离，使得每个p电极独立地连接到安装在驱动电路上的驱动电路的输出 AM面板。 LED微阵列被倒装贴合到AM面板上，使得AM面板分别控制LED像素，并且LED像素表现出优异的发射均匀性。 根据该结构，可以消除LED工艺与CMOS工艺之间的不兼容性。

公开(公告)号：US20110285284A1

公开(公告)日：2011-11-24

申请号：US12911372

申请日：2010-10-25

申请人： Yugang Zhou ,  Zhaoming Zeng ,  Yin Hing Lai ,  Chi Wing Keung ,  Chaojun Xu ,  Ruizhen Wang ,  Guowei David Xiao

发明人： Yugang Zhou ,  Zhaoming Zeng ,  Yin Hing Lai ,  Chi Wing Keung ,  Chaojun Xu ,  Ruizhen Wang ,  Guowei David Xiao

IPC分类号： F21V23/00 ,  H01L33/48

CPC分类号： H05B33/0821 ,  H01L25/0753 ,  H01L25/167 ,  H01L2224/16 ,  Y02B20/348

摘要： The present invention relates to a light emitting device using AC, comprising: at least one LED chip and an AC driving circuit chip, wherein the AC driving circuit chip comprises a substrate and a rectifying circuit integrated on the substrate. The LED chip is flipped and bonded on the AC driving circuit chip by flip-chip technology and electrically connected to the rectifying circuit, and the AC driving circuit chip converts the AC into DC for supply to the LED chip. The present invention further relates to a method of manufacturing the light emitting device using AC, comprising the following steps of: (1) forming an LED chip; (2) integrating a rectifying circuit on a substrate, forming two power source connecting terminals on the substrate, and forming an AC driving circuit chip; and (3) flip-chip bonding the LED chip on the AC driving circuit chip and in electrical connection with the rectifying circuit on the substrate. The light emitting device according to the present invention can be used by being directly connected to AC without needing any external integrated circuit device or electronic parts, thereby saving the assembling space and improving flexibility in use and meanwhile enhancing use efficiency of the light emitting regions.

摘要翻译： 本发明涉及一种使用AC的发光器件，包括：至少一个LED芯片和AC驱动电路芯片，其中所述AC驱动电路芯片包括集成在所述衬底上的衬底和整流电路。 LED芯片通过倒装芯片技术在AC驱动电路芯片上被翻转和接合，并且与整流电路电连接，并且AC驱动电路芯片将AC转换成DC以供给LED芯片。 本发明还涉及使用AC制造发光器件的方法，包括以下步骤：（1）形成LED芯片; （2）将整流电路集成在基板上，在基板上形成两个电源连接端子，形成交流驱动电路芯片; 和（3）将LED芯片倒装芯片连接在AC驱动电路芯片上并与基板上的整流电路电连接。 根据本发明的发光器件可以通过直接连接到AC而不需要任何外部集成电路器件或电子部件来使用，从而节省组装空间并提高使用的灵活性，同时提高发光区域的使用效率。