Invention Grant
US08557896B2 Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
有权
用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜
- Patent Title: Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
- Patent Title (中): 用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜
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Application No.: US12979008Application Date: 2010-12-27
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Publication No.: US08557896B2Publication Date: 2013-10-15
- Inventor: Chul Jeong , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
- Applicant: Chul Jeong , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0132244 20091228
- Main IPC: C08K9/06
- IPC: C08K9/06
Abstract:
An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.
Public/Granted literature
- US20110160339A1 ADHESIVE COMPOSITION FOR A SEMICONDUCTOR DEVICE, ADHESIVE FILM, AND DICING DIE-BONDING FILM Public/Granted day:2011-06-30
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