发明授权
US08557896B2 Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
有权
用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜
- 专利标题： Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
- 专利标题（中）： 用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜
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申请号： US12979008申请日： 2010-12-27
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公开(公告)号： US08557896B2公开(公告)日： 2013-10-15
- 发明人: Chul Jeong , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
- 申请人： Chul Jeong , Ki Tae Song , Han Nim Choi , Su Mi Im , Ah Ram Pyun , Sang Jin Kim
- 申请人地址： KR Gumi-si, Kyeongsangbuk-do
- 专利权人： Cheil Industries, Inc.
- 当前专利权人： Cheil Industries, Inc.
- 当前专利权人地址： KR Gumi-si, Kyeongsangbuk-do
- 代理机构： Lee & Morse, P.C.
- 优先权： KR10-2009-0132244 20091228
- 主分类号： C08K9/06
- IPC分类号： C08K9/06
摘要：
An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.