公开(公告)号：US07863758B2

公开(公告)日：2011-01-04

申请号：US12000070

申请日：2007-12-07

Applicant: Ki Sung Jung ,  Wan Jung Kim ,  Yong Woo Hong ,  Chang Bum Chung ,  Chul Jeong ,  Ah Ram Pyun ,  Su Mi Im ,  Kyoung Jin Ha

Inventor： Ki Sung Jung ,  Wan Jung Kim ,  Yong Woo Hong ,  Chang Bum Chung ,  Chul Jeong ,  Ah Ram Pyun ,  Su Mi Im ,  Kyoung Jin Ha

IPC: H01L23/488 ,  B32B27/36 ,  B32B27/38 ,  C08L63/00 ,  C08L67/02

CPC classification number: H01L21/6836 ,  C08K3/013 ,  C08K5/34922 ,  C08K5/50 ,  C08K5/5435 ,  C08K5/548 ,  C08K5/55 ,  C08L61/04 ,  C08L63/00 ,  C09D167/02 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/1461 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31786 ,  C08L2666/14 ,  H01L2924/00 ,  H01L2924/01083

Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.

Abstract translation: 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。

公开(公告)号：US20090162650A1

公开(公告)日：2009-06-25

申请号：US12314973

申请日：2008-12-19

Applicant: Yong Woo Hong ,  Wan Jung Kim ,  Su Mi Im ,  Ah Ram Pyun ,  Chul Jeong ,  Sang Jin Kim ,  Chang Beom Chung

Inventor： Yong Woo Hong ,  Wan Jung Kim ,  Su Mi Im ,  Ah Ram Pyun ,  Chul Jeong ,  Sang Jin Kim ,  Chang Beom Chung

IPC: B32B7/12 ,  B32B7/10 ,  B32B27/18 ,  B32B15/092 ,  C08L71/10 ,  C08K11/00 ,  C08K5/50

CPC classification number: H01L21/6836 ,  C08K5/50 ,  C08K5/5419 ,  C09D163/00 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2421/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/28 ,  H01L24/45 ,  H01L2221/68327 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T428/2848 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L2666/28 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48

Abstract: An adhesive film composition for semiconductor assembly includes an elastomer resin, an epoxy resin, a phenolic curing resin, and a silsesquioxane oligomer. The silsesquioxane oligomer may be present in an amount of about 0.01 to about 3 wt. %, based on the total solids content of the composition.

Abstract translation: 用于半导体组件的粘合膜组合物包括弹性体树脂，环氧树脂，酚类固化树脂和倍半硅氧烷低聚物。 倍半硅氧烷低聚物可以以约0.01至约3重量％的量存在。 ％，基于组合物的总固体含量。

公开(公告)号：US20080145668A1

公开(公告)日：2008-06-19

申请号：US12000070

申请日：2007-12-07

Applicant: Ki Sung Jung ,  Wan Jung Kim ,  Yong Woo Hong ,  Chang Bum Chung ,  Chul Jeong ,  Ah Ram Pyun ,  Su Mi Im ,  Kyoung Jin Ha

Inventor： Ki Sung Jung ,  Wan Jung Kim ,  Yong Woo Hong ,  Chang Bum Chung ,  Chul Jeong ,  Ah Ram Pyun ,  Su Mi Im ,  Kyoung Jin Ha

IPC: B32B27/38 ,  C08K7/00

CPC classification number: H01L21/6836 ,  C08K3/013 ,  C08K5/34922 ,  C08K5/50 ,  C08K5/5435 ,  C08K5/548 ,  C08K5/55 ,  C08L61/04 ,  C08L63/00 ,  C09D167/02 ,  H01L23/293 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/1461 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31786 ,  C08L2666/14 ,  H01L2924/00 ,  H01L2924/01083

Abstract: An adhesive film composition includes a polyester-based thermoplastic resin, an elastomer resin containing at least one of a hydroxyl group, a carboxyl group, or an epoxy group, an epoxy resin, a phenol curing agent, one or more of a latent catalytic curing agent or a curing catalyst, a silane coupling agent, and a filler.

Abstract translation: 粘合膜组合物包括聚酯类热塑性树脂，包含羟基，羧基或环氧基中的至少一种的弹性体树脂，环氧树脂，酚固化剂，潜在催化固化中的一种或多种 试剂或固化催化剂，硅烷偶联剂和填料。

公开(公告)号：US20110160339A1

公开(公告)日：2011-06-30

申请号：US12979008

申请日：2010-12-27

Applicant: Chul JEONG ,  Ki Tae Song ,  Han Nim Choi ,  Su Mi Im ,  Ah Ram Pyun ,  Sang Jin Kim

Inventor： Chul JEONG ,  Ki Tae Song ,  Han Nim Choi ,  Su Mi Im ,  Ah Ram Pyun ,  Sang Jin Kim

IPC: C08L63/00 ,  C08K7/16

CPC classification number: H01L24/29 ,  C08G59/621 ,  C08L21/00 ,  C09J163/00 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.

Abstract translation: 用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜，所述粘合剂组合物包括弹性体树脂，环氧树脂，可固化酚醛树脂，固化促进剂，硅烷偶联剂和填料，其中 硅烷偶联剂包括含环氧基的硅烷偶联剂和含过渡金属清除官能团的硅烷偶联剂。

公开(公告)号：US08557896B2

公开(公告)日：2013-10-15

申请号：US12979008

申请日：2010-12-27

Applicant: Chul Jeong ,  Ki Tae Song ,  Han Nim Choi ,  Su Mi Im ,  Ah Ram Pyun ,  Sang Jin Kim

Inventor： Chul Jeong ,  Ki Tae Song ,  Han Nim Choi ,  Su Mi Im ,  Ah Ram Pyun ,  Sang Jin Kim

IPC: C08K9/06

CPC classification number: H01L24/29 ,  C08G59/621 ,  C08L21/00 ,  C09J163/00 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An adhesive composition for semiconductor devices, an adhesive film, and a dicing die bonding film, the adhesive composition including an elastomer resin, an epoxy resin, a curable phenolic resin, a curing accelerator, a silane coupling agent, and a filler, wherein the silane coupling agent includes an epoxy group-containing silane coupling agent and a transition metal scavenging functional group-containing silane coupling agent.

Abstract translation: 用于半导体器件的粘合剂组合物，粘合剂膜和切割芯片接合膜，所述粘合剂组合物包括弹性体树脂，环氧树脂，可固化酚醛树脂，固化促进剂，硅烷偶联剂和填料，其中 硅烷偶联剂包括含环氧基的硅烷偶联剂和含过渡金属清除官能团的硅烷偶联剂。

公开(公告)号：US08623512B2

公开(公告)日：2014-01-07

申请号：US12970045

申请日：2010-12-16

Applicant: Ah Ram Pyun ,  Jae Hyun Cho ,  Ki Tae Song

Inventor： Ah Ram Pyun ,  Jae Hyun Cho ,  Ki Tae Song

IPC: B32B27/38 ,  C08G59/62 ,  C09J163/00 ,  H01L21/02

CPC classification number: C09J163/00 ,  C08G59/621 ,  C08L63/00 ,  C08L2205/02 ,  Y10T428/31511

Abstract: An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.

Abstract translation: 一种用于半导体的隐形切割的粘合剂组合物，粘合剂膜和包括粘合剂膜的半导体器件，该粘合剂组合物包括聚合物树脂，该聚合物树脂的玻璃化转变温度为约5℃至约35℃ 环氧树脂，包括液体环氧树脂和固体环氧树脂的环氧树脂，酚醛树脂固化剂，无机填料，固化催化剂和硅烷偶联剂。

公开(公告)号：US20110152394A1

公开(公告)日：2011-06-23

申请号：US12970045

申请日：2010-12-16

Applicant: Ah Ram PYUN ,  Jae Hyun Cho ,  Ki Tae Song

Inventor： Ah Ram PYUN ,  Jae Hyun Cho ,  Ki Tae Song

IPC: C09J163/00

CPC classification number: C09J163/00 ,  C08G59/621 ,  C08L63/00 ,  C08L2205/02 ,  Y10T428/31511

Abstract: An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic epoxy resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.

Abstract translation: 一种用于半导体的隐形切割的粘合剂组合物，粘合剂膜和包括粘合剂膜的半导体器件，该粘合剂组合物包括聚合物树脂，该聚合物树脂的玻璃化转变温度为约5℃至约35℃ 环氧树脂，包括液体环氧树脂和固体环氧树脂的环氧树脂，酚醛环氧树脂固化剂，无机填料，固化催化剂和硅烷偶联剂。