发明授权
- 专利标题： Integrated circuit packaging system with interconnects and method of manufacture thereof
- 专利标题（中）： 具有互连的集成电路封装系统及其制造方法
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申请号： US13071514申请日： 2011-03-25
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公开(公告)号： US08558369B2公开(公告)日： 2013-10-15
- 发明人: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Frederick Rodriguez Gahilig , Jairus Legaspi Pisigan
- 申请人： Zigmund Ramirez Camacho , Henry Descalzo Bathan , Frederick Rodriguez Gahilig , Jairus Legaspi Pisigan
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 I-Chang John Yang
- 主分类号： H01L25/00
- IPC分类号： H01L25/00
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a post of multiple plating layers having a base end with an inward protrusion, a connect riser, and a top end opposite the base end; positioning an integrated circuit device having a perimeter end facing the connect riser and the inward protrusion; attaching a bond wire directly on the inward protrusion and the integrated circuit device; and applying an encapsulation over the integrated circuit device, the bond wire, the inward protrusion, and around the post, the encapsulation exposing a portion of the base end and the top end of the post.