The present invention provides a method for inspecting chip defects. A raw image of a chip is used to extract a chip image. A binary chip edge image obtained from the chip image is used for inspecting defects, coordinated with statistics of edge pixels. During packaging the chip, defects that exceed inspection criteria and affect chip quality are quantitatively and accurately inspected out. The present invention has a simple procedure with high performance on inspecting defect modes and defect sizes. Thus, the present invention greatly improves performance and accuracy of inspections on chip defects for further saving a great amount of labor, time and cost.