A system for mounting an injection molding system actuator to a manifold and a clamp plate comprising: a mount comprised of a thermally conductive material having first and second thermally conductive surfaces, the actuator being mounted to the first thermally conductive surface in thermal communication with the second thermally conductive surface, the clamp plate being mounted in thermal communication with the second thermally conductive surface, the actuator being mounted in thermal communication with the heated manifold; wherein the clamp plate, manifold and mold are assembled together with the actuator and the mount in an assembled operating arrangement such that the second thermally conductive surface is in compressed contact with the clamp plate under a spring force.