发明授权
- 专利标题: Wafer fabrication process
- 专利标题(中): 晶圆制造工艺
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申请号: US13475997申请日: 2012-05-20
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公开(公告)号: US08562749B2公开(公告)日: 2013-10-22
- 发明人: Jeffrey E. LeClaire , Kenneth G. Roessler , David Brinkley
- 申请人: Jeffrey E. LeClaire , Kenneth G. Roessler , David Brinkley
- 申请人地址: US FL Delray Beach
- 专利权人: Rave LLC
- 当前专利权人: Rave LLC
- 当前专利权人地址: US FL Delray Beach
- 代理机构: Baker & Hostetler LLP
- 主分类号: B08B7/00
- IPC分类号: B08B7/00
摘要:
A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.
公开/授权文献
- US20120231397A1 Wafer Fabrication Process 公开/授权日:2012-09-13