发明授权
US08563338B2 Light emitting diode package having an LED chip mounted on a phosphor substrate
有权
具有安装在荧光体基板上的LED芯片的发光二极管封装
- 专利标题： Light emitting diode package having an LED chip mounted on a phosphor substrate
- 专利标题（中）： 具有安装在荧光体基板上的LED芯片的发光二极管封装
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申请号： US13369157申请日： 2012-02-08
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公开(公告)号： US08563338B2公开(公告)日： 2013-10-22
- 发明人: Jung Kyu Park , Yu Dong Kim , Seung Hwan Choi , Seong Ah Joo
- 申请人： Jung Kyu Park , Yu Dong Kim , Seung Hwan Choi , Seong Ah Joo
- 申请人地址： KR Suwon-Si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-Si
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2007-0094376 20070917
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.
公开/授权文献
- US20120142127A1 LIGHT EMITTING DIODE PACKAGE WITH A PHOSPHOR SUBSTRATE 公开/授权日：2012-06-07