公开(公告)号：US20090072256A1

公开(公告)日：2009-03-19

申请号：US12000958

申请日：2007-12-19

申请人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

发明人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

摘要翻译： 提供了包括荧光体基板的发光二极管（LED）封装; 安装在荧光体基板上的LED芯片; 安装在除了安装有LED芯片的区域之外的荧光体基板的另一区域上的电路板; 用于电连接LED芯片和电路板的电极连接部分; 以及覆盖LED芯片，电路板和荧光体基板的密封构件。

公开(公告)号：US08563338B2

公开(公告)日：2013-10-22

申请号：US13369157

申请日：2012-02-08

申请人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

发明人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

IPC分类号： H01L21/00

CPC分类号： H01L33/505 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

摘要翻译： 提供了包括荧光体基板的发光二极管（LED）封装; 安装在荧光体基板上的LED芯片; 安装在除了安装有LED芯片的区域之外的荧光体基板的另一区域上的电路板; 用于电连接LED芯片和电路板的电极连接部分; 以及覆盖LED芯片，电路板和荧光体基板的密封构件。

公开(公告)号：US08143634B2

公开(公告)日：2012-03-27

申请号：US12000958

申请日：2007-12-19

申请人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

发明人： Jung Kyu Park ,  Yu Dong Kim ,  Seung Hwan Choi ,  Seong Ah Joo

IPC分类号： H01L33/00

CPC分类号： H01L33/505 ,  H01L24/97 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

摘要： Provided is a light emitting diode (LED) package including a phosphor substrate; an LED chip mounted on the phosphor substrate; a circuit board mounted on the other region of the phosphor substrate excluding the region where the LED chip is mounted; an electrode connection portion for electrically connecting the LED chip and the circuit board; and a sealing member that covers the LED chip, the circuit board, and the phosphor substrate.

摘要翻译： 提供了包括荧光体基板的发光二极管（LED）封装; 安装在荧光体基板上的LED芯片; 安装在除了安装有LED芯片的区域之外的荧光体基板的另一区域上的电路板; 用于电连接LED芯片和电路板的电极连接部分; 以及覆盖LED芯片，电路板和荧光体基板的密封构件。

公开(公告)号：US08132953B2

公开(公告)日：2012-03-13

申请号：US12244393

申请日：2008-10-02

申请人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

发明人： Jung Kyu Park ,  Seong Ah Joo ,  Seung Hwan Choi

IPC分类号： F21V7/04

CPC分类号： G02F1/133603 ,  G02F1/133605 ,  G02F2001/133612 ,  H05K1/0274 ,  H05K1/053 ,  H05K1/092 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10S362/80

摘要： There are provided a light emitting diode substrate module and a method of manufacturing the same, and a backlight unit and a method of manufacturing the same. A light emitting diode substrate module according to an aspect of the invention includes: a metal plate; an insulating film having a predetermined thickness and provided on an entire outer surface of the metal plate; a reflective film having a predetermined thickness and provided on an entire outer surface of the insulating film; and at least one light emitting diode package electrically connected to a driving circuit provided on the reflective film by pattern printing.Unnecessary material costs can be avoided by forming a predetermined driving circuit by pattern printing, and optical characteristics can be improved by stably maintaining reflection characteristics.

摘要翻译： 提供了一种发光二极管衬底模块及其制造方法，以及背光单元及其制造方法。 根据本发明的一个方面的发光二极管衬底模块包括：金属板; 具有预定厚度并设置在金属板的整个外表面上的绝缘膜; 具有预定厚度并设置在绝缘膜的整个外表面上的反射膜; 以及通过图案印刷电连接到设置在反射膜上的驱动电路的至少一个发光二极管封装。 通过图案印刷形成预定的驱动电路可以避免不必要的材料成本，通过稳定地保持反射特性可以提高光学特性。

公开(公告)号：US08168997B2

公开(公告)日：2012-05-01

申请号：US12192175

申请日：2008-08-15

申请人： Seong Ah Joo ,  Jung Kyu Park ,  Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi

发明人： Seong Ah Joo ,  Jung Kyu Park ,  Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H05K1/09 ,  H05K3/24 ,  H05K2201/10106 ,  H01L2924/00014

摘要： Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.

摘要翻译： 提供了一种包括印刷电路板（PCB）的LED封装; 导电结构，其形成在PCB上并且由选自硅结构和铝结构中的任何一种构成; 以及安装在PCB上并通过导电结构电连接到PCB的LED芯片。

公开(公告)号：US20090085052A1

公开(公告)日：2009-04-02

申请号：US12207615

申请日：2008-09-10

申请人： Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi ,  Seong Ah Joo ,  Jung Kyu Park

发明人： Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi ,  Seong Ah Joo ,  Jung Kyu Park

IPC分类号： H01L33/00

CPC分类号： H01L33/0075 ,  H01L33/32 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16

摘要： The present invention relates to a GaN type LED device and a method of manufacturing the same. More particularly, there are provided a GaN type LED device including an LED chip; and a submount eutectic-bonded with the LED chip through an adhesive layer, wherein the adhesive layer is configured by soldering a plurality of metallic layers in which a first metallic layer and a second metallic layer are sequentially stacked, and the second metallic layer is formed in a paste form.Further, the present invention provides a method of manufacturing the GaN type LED device.

摘要翻译： 本发明涉及GaN型LED器件及其制造方法。 更具体地，提供了包括LED芯片的GaN型LED器件; 以及通过粘合剂层与LED芯片共晶结合的底座，其中，所述粘合层通过焊接多个金属层构成，其中第一金属层和第二金属层依次层叠，并且形成所述第二金属层 以糊状形式。 此外，本发明提供一种制造GaN型LED器件的方法。

公开(公告)号：US20090050923A1

公开(公告)日：2009-02-26

申请号：US12192175

申请日：2008-08-15

申请人： Seong Ah Joo ,  Jung Kyu Park ,  Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi

发明人： Seong Ah Joo ,  Jung Kyu Park ,  Kun Yoo Ko ,  Young June Jeong ,  Seung Hwan Choi

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L2224/48091 ,  H01L2924/01322 ,  H05K1/09 ,  H05K3/24 ,  H05K2201/10106 ,  H01L2924/00014

摘要： Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.

摘要翻译： 提供了一种包括印刷电路板（PCB）的LED封装; 导电结构，其形成在PCB上并且由选自硅结构和铝结构中的任何一种构成; 以及安装在PCB上并通过导电结构电连接到PCB的LED芯片。

公开(公告)号：US20090072119A1

公开(公告)日：2009-03-19

申请号：US12000959

申请日：2007-12-19

申请人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

发明人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

IPC分类号： G01J1/44

CPC分类号： G01J5/60 ,  G01J1/32 ,  G01J2001/4252

摘要： Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.

摘要翻译： 提供了一种背光单元，其包括用于产生光的一个或多个白色发光二极管（LED） 具有印刷电路板（PCB）的LED模块，所述LED模块支撑并驱动所述白色LED; 用于检测白色LED的色温的传感器; 连接到所述LED模块的发热元件; 以及用于控制传感器，LED模块和发热元件的控制器。

公开(公告)号：US07705278B2

公开(公告)日：2010-04-27

申请号：US12000959

申请日：2007-12-19

申请人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

发明人： Jung Kyu Park ,  Seong Ah Joo ,  Hun Joo Hahm

IPC分类号： G01J1/32 ,  G09G3/36

CPC分类号： G01J5/60 ,  G01J1/32 ,  G01J2001/4252

摘要： Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.

摘要翻译： 提供了一种背光单元，其包括用于产生光的一个或多个白色发光二极管（LED） 具有印刷电路板（PCB）的LED模块，所述LED模块支撑并驱动所述白色LED; 用于检测白色LED的色温的传感器; 连接到所述LED模块的发热元件; 以及用于控制传感器，LED模块和发热元件的控制器。

公开(公告)号：US07598528B2

公开(公告)日：2009-10-06

申请号：US11808810

申请日：2007-06-13

申请人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

发明人： Kyung Seob Oh ,  Jae Ky Roh ,  Jung Kyu Park ,  Jong Hwan Baek ,  Seung Hwan Choi

IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L29/24

CPC分类号： H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49113 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A high power Light Emitting Diode (LED) package and a method of producing the same. The high power LED package according to the present invention includes a plurality of light emitting diode chips, a first lead frame with the light emitting diode chips mounted thereon, and a second lead frame disposed at a predetermined interval from the first lead frame. The LED package also includes a package body fixing the first and second lead frames and bonding wires for electrically connecting the plurality of LED chips. The package body includes at least one first reflecting part separately surrounding each of the plurality of LED chips with upward-inclined inner side walls thereof and a second reflecting part surrounding the entire plurality of LED chips with an upward-inclined inner side wall thereof.

摘要翻译： 一种高功率发光二极管（LED）封装及其制造方法。 根据本发明的大功率LED封装包括多个发光二极管芯片，其上安装有发光二极管芯片的第一引线框架和从第一引线框架以预定间隔设置的第二引线框架。 LED封装还包括固定第一和第二引线框架以及用于电连接多个LED芯片的接合线的封装体。 封装体包括至少一个第一反射部分，其分别围绕多个LED芯片中的每一个具有向上倾斜的内侧壁，以及围绕整个多个LED芯片的第二反射部分，其具有向上倾斜的内侧壁。