发明授权
- 专利标题： Package tolerate design and method
- 专利标题（中）： 封装容许设计和方法
-
申请号： US13090234申请日： 2011-04-19
-
公开(公告)号： US08564075B1公开(公告)日： 2013-10-22
- 发明人: Daniel N. Koury, Jr.
- 申请人： Daniel N. Koury, Jr.
- 申请人地址： US CA San Jose
- 专利权人： mCube Inc.
- 当前专利权人： mCube Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Kilpatrick Townsend & Stockton LLP
- 主分类号： H01L27/14
- IPC分类号： H01L27/14
摘要：
An improved MEMS transducer apparatus and method. The apparatus has a movable base structure including an outer surface region and an inner surface region. At least one central anchor structure can be spatially disposed within a vicinity of the inner surface region and at least one peripheral anchor structure can be spatially disposed within a vicinity of the outer surface region. Additionally, the apparatus can have at least one peripheral spring structure. The peripheral spring structure(s) can be coupled to the peripheral anchor structure(s) and at least one portion of the outer surface region. The apparatus can also have at least one central spring structure. The central spring structure(s) can be operably coupled to the central anchor structure(s) and at least one portion of the inner surface region.
信息查询
IPC分类:
