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    Method to test the quality factor of a MEMS gyroscope at chip probe
    1.
    发明授权
    Method to test the quality factor of a MEMS gyroscope at chip probe 有权

    公开(公告)号：US10267636B1

    公开(公告)日：2019-04-23

    申请号：US14987685

    申请日：2016-01-04

    申请人： mCube, Inc.

    发明人： Sudheer S. Sridharamurthy ,  Tony Maraldo ,  Zheng-Yao Sun ,  Wenhua Zhang ,  Te-Hsi Terrence Lee ,  Sanjay Bhandari ,  Joseph Rastegar

    IPC分类号： G01C19/5684 ,  B81C99/00

    摘要： A method for a MEMS device comprises determining in a computer system, a first driving signal for the MEMS device in response to a first time delay and to a base driving signal, applying the first driving signal to the MEMS device to induce the MEMS device to operate at a first frequency, determining a second driving signal for the MEMS device in response to a second time delay and to the base driving signal, applying the second driving signal to the MEMS device to induce the MEMS device to operate at a second frequency, determining a first quality factor associated with the MEMS device in response to the first frequency and the second frequency, determining a quality factor associated with the MEMS device in response to the first quality factor, and determining whether the quality factor associated with the MEMS device, exceeds a threshold quality factor.

    Method to package multiple mems sensors and actuators at different gases and cavity pressures
    2.
    发明授权
    Method to package multiple mems sensors and actuators at different gases and cavity pressures 有权

    公开(公告)号：US10183860B2

    公开(公告)日：2019-01-22

    申请号：US14887622

    申请日：2015-10-20

    申请人： mCube Inc.

    发明人： Wenhua Zhang ,  Shingo Yoneoka

    IPC分类号： B81B7/02 ,  B81C1/00 ,  B81B7/00 ,  H01L21/56 ,  H01L41/113

    摘要： A method for fabricating a multiple MEMS device includes providing a semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel. The first MEMS is encapsulated within the first cavity and the second MEMS device is encapsulated within the second cavity. These devices is encapsulated within a first encapsulation environment at a first air pressure, and encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity is then subjected to a second encapsulating environment at a second air pressure via the channel of the second cavity.

    Multi-axis integrated MEMS inertial sensing device on single packaged chip
    3.
    发明授权
    Multi-axis integrated MEMS inertial sensing device on single packaged chip 有权

    公开(公告)号：US10132630B2

    公开(公告)日：2018-11-20

    申请号：US14162718

    申请日：2014-01-23

    申请人： mCube Inc.

    发明人： Terrence Lee ,  Wenhua Zhang ,  Sudheer Sridharamurthy ,  Shingo Yoneoka

    IPC分类号： G01C19/5783 ,  G01C19/56 ,  G01P1/00 ,  B81B7/00 ,  G01P15/18 ,  G01P15/02 ,  G01P15/08

    摘要： A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially configured with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.

    Integrated inertial sensing device
    4.
    发明授权
    Integrated inertial sensing device 有权

    公开(公告)号：US10107625B2

    公开(公告)日：2018-10-23

    申请号：US15442488

    申请日：2017-02-24

    申请人： mCube Inc.

    发明人： Sanjay Bhandari ,  Ali J. Rastegar ,  Sudheer S. Sridharamurthy

    IPC分类号： G01P3/00 ,  G01C19/5712 ,  B81B7/02 ,  B81B7/00

    摘要： A CMOS IC substrate can include sense amplifiers, demodulation circuits and AGC loop circuit coupled to the MEMS gyroscope. The AGC loop acts in a way such that generated desired signal amplitude out of the drive signal maintains MEMS resonator velocity at a desired frequency and amplitude. The system can include charge pumps to create higher voltages as required in the system. The system can incorporate ADC to provide digital outputs that can be read via serial interface such as I2C. The system can also include temperature sensor which can be used to sense and output temperature of the chip and system and can be used to internally or externally compensate the gyroscope sensor measurements for temperature related changes. The CMOS IC substrate can be part of a system which can include a MEMS gyroscope having a MEMS sensor overlying the CMOS IC substrate.

    Multi-axis MEMS rate sensor device
    5.
    发明授权
    Multi-axis MEMS rate sensor device 有权

    公开(公告)号：US10036635B2

    公开(公告)日：2018-07-31

    申请号：US14163789

    申请日：2014-01-24

    申请人： mCube Inc.

    发明人： Wenhua Zhang ,  Sudheer Sridharamurthy ,  Shingo Yoneoka ,  Terrence Lee

    IPC分类号： B81B3/00 ,  G01C19/574

    CPC分类号： G01C19/574

    摘要： A MEMS rate sensor device. In an embodiment, the sensor device includes a MEMS rate sensor configured overlying a CMOS substrate. The MEMS rate sensor can include a driver set, with four driver elements, and a sensor set, with six sensing elements, configured for 3-axis rotational sensing. This sensor architecture allows low damping in driving masses and high damping in sensing masses, which is ideal for a MEMS rate sensor design. Low driver damping is beneficial to MEMS rate power consumption and performance, with low driving electrical potential to achieve high oscillation amplitude.

    MULTIPLE MEMS DEVICE AND METHODS
    7.
    发明申请
    MULTIPLE MEMS DEVICE AND METHODS 审中-公开

    公开(公告)号：US20170248628A1

    公开(公告)日：2017-08-31

    申请号：US15444162

    申请日：2017-02-27

    申请人： mCube, Inc.

    发明人： Sanjay BHANDARI ,  Ken WANG ,  Ben LEE

    IPC分类号： G01P15/08 ,  B81B7/00

    CPC分类号： G01P15/08 ,  B81B7/0074 ,  B81B7/0087 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  G01P15/0802 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.

    Indoor map data as a recalibration source for low-cost MEMS inertial navigation
    9.
    发明授权
    Indoor map data as a recalibration source for low-cost MEMS inertial navigation 有权
    室内地图数据作为低成本MEMS惯性导航的重新校准源

    公开(公告)号：US09377308B2

    公开(公告)日：2016-06-28

    申请号：US13758707

    申请日：2013-02-04

    申请人： mCube, Incorporated

    发明人： Joe Kelly ,  Jobe Price ,  Rahul Bakshi ,  Mark D. Schneider

    IPC分类号： G01C21/16 ,  G01C21/20 ,  G01C25/00

    CPC分类号： G01C21/16 ,  G01C21/206 ,  G01C25/005

    摘要： A computer-implemented method for determining an estimated user location performed on a computer system programmed to perform the method includes determining in physical sensors, movements in response to movement of the computer system, determining in a processor a physical context, in response to the movements, determining in the processor whether the physical context is substantially similar to a map-based context associated with a location on the map, when a map-based context is substantially similar to the physical context, the method includes determining in the processor the location on the map associated with the map-based context, determining in the processor a graphical user interface in response to the location on the map, and displaying the graphical user interface on a display of the computer system.

    摘要翻译： 用于确定在被编程为执行该方法的计算机系统上执行的估计用户位置的计算机实现的方法包括在物理传感器中确定响应于计算机系统的移动的移动，响应于该运动在处理器中确定物理上下文 在所述处理器中确定所述物理上下文是否基本上类似于与所述地图上的位置相关联的基于地图的上下文，当基于地图的上下文基本上类似于所述物理上下文时，所述方法包括在所述处理器中确定位置 所述地图与所述基于地图的上下文相关联，在所述处理器中确定响应于所述地图上的位置的图形用户界面，以及在所述计算机系统的显示器上显示所述图形用户界面。

    INTEGRATED CMOS AND MEMS DEVICES WITH AIR DIELETRICS
    10.
    发明申请
    INTEGRATED CMOS AND MEMS DEVICES WITH AIR DIELETRICS 有权
    集成CMOS和MEMS器件与空气通风

    公开(公告)号：US20160060102A1

    公开(公告)日：2016-03-03

    申请号：US13855988

    申请日：2013-04-03

    申请人： MCube, Inc.

    发明人： Xiao Charles Yang

    IPC分类号： B81B7/00 ,  H01L27/092

    CPC分类号： B81B7/008 ,  B81B7/0038 ,  B81B2207/094 ,  B81C1/00238 ,  B81C1/00246 ,  H01L21/8221 ,  H01L27/092 ,  H01L29/0649 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A monolithically integrated CMOS and MEMS device. The device includes a first semiconductor substrate having a first surface region and one or more CMOS IC devices on a CMOS IC device region overlying the first surface region. The CMOS IC device region can also have a CMOS surface region. A bonding material can be provided overlying the CMOS surface region to form an interface by which a second semiconductor substrate can be joined to the CMOS surface region. The second semiconductor substrate has a second surface region coupled to the CMOS surface region by bonding the second surface region to the bonding material. The second semiconductor substrate includes one or more first air dielectric regions. One or more free standing MEMS structures can be formed within one or more portions of the processed first substrate.

    摘要翻译： 单片集成CMOS和MEMS器件。 该器件包括第一半导体衬底，该第一半导体衬底具有覆盖第一表面区域的CMOS IC器件区域上的第一表面区域和一个或多个CMOS IC器件。 CMOS IC器件区域也可以具有CMOS表面区域。 可以提供覆盖CMOS表面区域的接合材料，以形成可将第二半导体衬底接合到CMOS表面区域的界面。 第二半导体衬底具有通过将第二表面区域结合到接合材料而耦合到CMOS表面区域的第二表面区域。 第二半导体衬底包括一个或多个第一空气介电区域。 可以在经处理的第一基板的一个或多个部分内形成一个或多个独立的MEMS结构。