Invention Grant
US08566759B2 Structure for on chip shielding structure for integrated circuits or devices on a substrate
有权
用于集成电路或基板上的器件的片上屏蔽结构的结构
- Patent Title: Structure for on chip shielding structure for integrated circuits or devices on a substrate
- Patent Title (中): 用于集成电路或基板上的器件的片上屏蔽结构的结构
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Application No.: US12046750Application Date: 2008-03-12
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Publication No.: US08566759B2Publication Date: 2013-10-22
- Inventor: Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Xuefeng Liu
- Applicant: Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Xuefeng Liu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A design structure is embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit. The design structure comprises: a conductive structure surrounding and accommodating a circuit or a circuit device arranged on a substrate and at least one feed through capacitor and one transmission line associated with the conductive structure and providing the power supply and signals to the circuit or circuit device respectively. The design structure also comprises a shielding structure surrounding a circuit or a circuit device arranged on a substrate and at least one feed through capacitor or a transmission line arranged on a side of the shielding structure.
Public/Granted literature
- US20090055790A1 DESIGN STRUCTURE FOR ON CHIP SHIELDING STRUCTURE FOR INTEGRATED CIRCUITS OR DEVICES ON A SUBSTRATE Public/Granted day:2009-02-26
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