Invention Grant
US08569875B2 Integrally molded die and bezel structure for fingerprint sensors and the like 有权
用于指纹传感器等的整体模制模具和表圈结构

Integrally molded die and bezel structure for fingerprint sensors and the like
Abstract:
A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.
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