公开(公告)号：US08772884B2

公开(公告)日：2014-07-08

申请号：US13960405

申请日：2013-08-06

Applicant: Apple Inc.

Inventor： Robert Henry Bond ,  Alan Kramer ,  Giovanni Gozzini

IPC: H01L23/31

CPC classification number: G06K9/00053 ,  G06K9/0002 ,  H01L27/20

Abstract: A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.

Abstract translation: 诸如指纹传感器的生物测定传感器装置包括一个衬底，在衬底上安装有一个模具，其上形成有传感器阵列和至少一个导电边框。 模具和表圈被封装在一体的封装结构中，以保护这些元件免受机械，电气和环境损害，但是传感器阵列的一部分和边框暴露或者至少被封装或其他涂层材料结构所覆盖 。

公开(公告)号：US08569875B2

公开(公告)日：2013-10-29

申请号：US13767141

申请日：2013-02-14

Applicant: Apple, Inc.

Inventor： Robert Henry Bond ,  Alan Kramer ,  Giovanni Gozzini

IPC: H01L23/31

CPC classification number: G06K9/00053 ,  G06K9/0002 ,  H01L27/20

Abstract: A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.

Abstract translation: 诸如指纹传感器的生物测定传感器装置包括一个衬底，在衬底上安装有一个模具，其上形成有传感器阵列和至少一个导电边框。 模具和表圈被封装在一体的封装结构中，以保护这些元件免受机械，电气和环境损害，但是传感器阵列的一部分和边框暴露或者至少被封装或其他涂层材料结构所覆盖 。