发明授权
- 专利标题： Accessing or interconnecting integrated circuits
- 专利标题（中）： 访问或互连集成电路
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申请号： US13351142申请日： 2012-01-16
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公开(公告)号： US08569879B2公开(公告)日： 2013-10-29
- 发明人: Kevin Atkinson , Clifford H. Boler
- 申请人： Kevin Atkinson , Clifford H. Boler
- 申请人地址： US MN Eden Prairie
- 专利权人： CrossFire Technologies, Inc.
- 当前专利权人： CrossFire Technologies, Inc.
- 当前专利权人地址： US MN Eden Prairie
- 代理机构： Schwegman, Lundberg & Woessner, P.A.
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L29/40
摘要：
Multiple integrated circuits (ICs) die, from different wafers, can be picked-and-placed, front-side planarized using a vacuum applied to a planarizing disk, and attached to each other or a substrate. The streets between the IC die can be filled, and certain techniques or fixtures allow application of monolithic semiconductor wafer processing for interconnecting different die. High density I/O connections between different IC die can be obtained using structures and techniques for aligning vias to I/O structures, and (programmably routing IC I/O lines to appropriate vias. Existing IC die can be retrofitted for such interconnection to other IC die, such as by using similar techniques or tools.
公开/授权文献
- US20120112245A1 ACCESSING OR INTERCONNECTING INTEGRATED CIRCUITS 公开/授权日：2012-05-10
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