Invention Grant
- Patent Title: Circuit board with via hole and electronic device equipped with the same
- Patent Title (中): 电路板带通孔和电子设备配备相同
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Application No.: US12873315Application Date: 2010-08-31
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Publication No.: US08570765B2Publication Date: 2013-10-29
- Inventor: Cheng-Yu Wang , Chang-Hsu Yen
- Applicant: Cheng-Yu Wang , Chang-Hsu Yen
- Applicant Address: TW Taipei
- Assignee: ASUSTeK Computer Inc.
- Current Assignee: ASUSTeK Computer Inc.
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04
Abstract:
A circuit board includes a main body, an electronic component, a fixing portion and at least one via hole. The electronic component and the fixing portion are disposed on the main body. The at least one via hole is formed on the main body and adjacent to the fixing portion.
Public/Granted literature
- US20120051008A1 CIRCUIT BOARD WITH VIA HOLE AND ELECTRONIC DEVICE EQUIPPED WITH THE SAME Public/Granted day:2012-03-01
Information query
