- 专利标题： Electronic device housing assembly
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申请号： US11888407申请日： 2007-07-31
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公开(公告)号： US08574696B2公开(公告)日： 2013-11-05
- 发明人: Jeffrey A. Lev , Steven S. Homer
- 申请人： Jeffrey A. Lev , Steven S. Homer
- 申请人地址： US TX Houston
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Houston
- 主分类号： B32B1/00
- IPC分类号： B32B1/00 ; B32B3/10 ; B32B5/02
摘要：
An electronic device comprising a housing assembly having at least one fiber composite layer molded into a portion of the housing assembly, the at least one fiber composite layer having a warp direction and configured to provide strength to the housing assembly corresponding to the warp direction.
公开/授权文献
- US20090035549A1 Electronic device housing assembly 公开/授权日：2009-02-05
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