Invention Grant
- Patent Title: Shell structure and manufacturing method for shell structure of electronic device
- Patent Title (中): 壳体结构及电子装置外壳结构的制造方法
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Application No.: US13332398Application Date: 2011-12-21
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Publication No.: US08574702B2Publication Date: 2013-11-05
- Inventor: Jung-Chin Wu , Po-An Lin , Kuo-Nan Ling , Han-Ching Huang , Chih-Wen Chiang , Chien-Min Chang
- Applicant: Jung-Chin Wu , Po-An Lin , Kuo-Nan Ling , Han-Ching Huang , Chih-Wen Chiang , Chien-Min Chang
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: B32B3/12
- IPC: B32B3/12
Abstract:
A shell structure includes a composite material layer and a second material layer is provided. The composite material layer includes a woven layer and a first material layer. The woven layer has a first surface and a second surface opposite to each other. The first material layer is located on the first surface and has a plurality of through-holes. The second material layer is disposed on the first material layer and has a plurality of extending-portions adapted to be combined with the woven layer and fix the second material layer and the composite material layer to each other. In addition, a manufacturing method for shell structure of electronic device is also provided.
Public/Granted literature
- US20120164360A1 SHELL STRUCTURE AND MANUFACTURING METHOD FOR SHELL STRUCTURE OF ELECTRONIC DEVICE Public/Granted day:2012-06-28
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