发明授权
- 专利标题: Semiconductor device and manufacturing method of the semiconductor device
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13415482申请日: 2012-03-08
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公开(公告)号: US08575704B2公开(公告)日: 2013-11-05
- 发明人: Masaki Haneda , Akiyoshi Hatada , Akira Katakami , Yuka Kase , Kazuya Okubo
- 申请人: Masaki Haneda , Akiyoshi Hatada , Akira Katakami , Yuka Kase , Kazuya Okubo
- 申请人地址: JP Yokohama
- 专利权人: Fujitsu Semiconductor Limited
- 当前专利权人: Fujitsu Semiconductor Limited
- 当前专利权人地址: JP Yokohama
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2011-092285 20110418
- 主分类号: H01L21/70
- IPC分类号: H01L21/70 ; H01L21/336
摘要:
A semiconductor device includes a semiconductor substrate, a device region including first and second parts, first and second gate electrodes formed in the first and the second parts, first and second source regions, first and second drain regions, first, second, third, and fourth embedded isolation film regions formed under the first source, the first drain, the second source, and the second drain regions, respectively. Further, the first drain region and the second source region form a single diffusion region, the second and the third embedded isolation film regions form a single embedded isolation film region, an opening is formed in a part of the single diffusion region so as to extend to the second and the third embedded isolation film regions, and the opening is filled with an isolation film.
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