发明授权
- 专利标题： Component for electronic apparatus
- 专利标题（中）： 电子设备组件
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申请号： US13306014申请日： 2011-11-29
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公开(公告)号： US08579648B2公开(公告)日： 2013-11-12
- 发明人: Shu Kagami , Jun Kondo , Kazufumi Serizawa
- 申请人： Shu Kagami , Jun Kondo , Kazufumi Serizawa
- 申请人地址： JP Kariya
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JP Kariya
- 代理机构： Nixon & Vanderhye P.C.
- 优先权： JP2010-273574 20101208
- 主分类号： H01R4/50
- IPC分类号： H01R4/50
摘要：
A component for an electronic apparatus has an insulating member that has a plurality of through holes in parallel in which the lead wires are inserted and a shield cover in which an insulating member insertion hole where the insulating member is inserted is formed that cut offs an electrical noise. The insulating member is formed in an integrated shape where parts of adjoining cylindrical parts in which the through holes are formed overlapping mutually when seen along an axial direction of the through hole. The insulating member insertion hole becomes a single hole formed identical to an outer shape of the insulating member when seen along the axial direction of the through hole.
公开/授权文献
- US20120149242A1 COMPONENT FOR ELECTRONIC APPARATUS 公开/授权日：2012-06-14
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