发明授权
- 专利标题： Stacked dual chip package and method of fabrication
- 专利标题（中）： 堆叠式双芯片封装及其制造方法
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申请号： US12819111申请日： 2010-06-18
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公开(公告)号： US08581376B2公开(公告)日： 2013-11-12
- 发明人: Hamza Yilmaz , Xiaotian Zhang , Yan Xun Xue , Anup Bhalla , Jun Lu , Kai Liu , Yueh-Se Ho , John Amato
- 申请人： Hamza Yilmaz , Xiaotian Zhang , Yan Xun Xue , Anup Bhalla , Jun Lu , Kai Liu , Yueh-Se Ho , John Amato
- 申请人地址： US CA Sunnyvale
- 专利权人： Alpha & Omega Semiconductor Incorporated
- 当前专利权人： Alpha & Omega Semiconductor Incorporated
- 当前专利权人地址： US CA Sunnyvale
- 代理商 Kenneth C. Brooks
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/31
摘要：
The present invention is directed to a lead-frame having a stack of semiconductor dies with interposed metalized clip structure. Level projections extend from the clip structure to ensure that the clip structure remains level during fabrication.
公开/授权文献
- US20110227207A1 STACKED DUAL CHIP PACKAGE AND METHOD OF FABRICATION 公开/授权日：2011-09-22
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