A semiconductor device includes a first wafer having at least one first integrated-circuit chip and a first support layer surrounding the first integrated circuit chip. A first electrical-connection layer is placed on a frontside of the first wafer and includes a first electrical-connection network. A second wafer is placed on a frontside of the first electrical-connection layer. The second wafer includes at least one second integrated-circuit chip and a second support layer surrounding the second integrate circuit chip. The second integrated circuit chip has an active side facing the first electrical-connection layer, and one or more through-holes filled with a conductor forming electrical-connection vias. A second electrical-connection layer is placed on the backside of the second wafer and includes a second electrical-connection network.