Invention Grant
- Patent Title: Method and apparatus for automatic measurement of pad geometry and inspection thereof
- Patent Title (中): 用于自动测量垫几何形状和检查方法和装置
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Application No.: US11613087Application Date: 2006-12-19
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Publication No.: US08588511B2Publication Date: 2013-11-19
- Inventor: Gang Liu , Aaron S. Wallack , David J. Michael
- Applicant: Gang Liu , Aaron S. Wallack , David J. Michael
- Applicant Address: US MA Natick
- Assignee: Cognex Corporation
- Current Assignee: Cognex Corporation
- Current Assignee Address: US MA Natick
- Agency: Loginov & Associates, PLLC
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G06K9/48 ; H04N7/18
Abstract:
An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.
Public/Granted literature
- US20080144917A1 Method and Apparatus for Automatic Measurement of Pad Geometry and Inspection thereof Public/Granted day:2008-06-19
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