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    Line scan calibration method and apparatus
    1.
    发明授权
    Line scan calibration method and apparatus 有权
    线扫描校准方法和装置

    公开(公告)号：US08872911B1

    公开(公告)日：2014-10-28

    申请号：US12652353

    申请日：2010-01-05

    申请人： Aaron S. Wallack ,  David J. Michael

    发明人： Aaron S. Wallack ,  David J. Michael

    IPC分类号： H04N9/10 ,  H04N7/18

    CPC分类号： H04N7/183 ,  G06T7/70 ,  G06T2207/30244

    摘要： A method and apparatus for assessing at least one of motion linearity of a motion stage, stage motion straightness of a motion stage, image capture repeatability of a motion stage and camera and accuracy of a calibration plate used to assess motion stage characteristics, the method including using a line scan camera to generate two dimensional images of a calibration plate having a plurality imageable features thereon, examining the images to identify actual coordinates of the imageable features and using the actual coordinates to assess linearity, straightness, repeatability and/or plate accuracy.

    摘要翻译： 一种用于评估运动舞台的运动线性度，运动舞台运动平直度，运动舞台和相机的图像捕获重复性以及用于评估运动舞台特征的校准板的精度中的至少一个的方法和装置，所述方法包括 使用线扫描相机来生成其上具有多个可成像特征的校准板的二维图像，检查图像以识别可成像特征的实际坐标，并使用实际坐标来评估线性，直线性，重复性和/或印版精度。

    Method and apparatus for automatic measurement of pad geometry and inspection thereof
    2.
    发明授权
    Method and apparatus for automatic measurement of pad geometry and inspection thereof 有权
    用于自动测量垫几何形状和检查方法和装置

    公开(公告)号：US08588511B2

    公开(公告)日：2013-11-19

    申请号：US11613087

    申请日：2006-12-19

    申请人： Gang Liu ,  Aaron S. Wallack ,  David J. Michael

    发明人： Gang Liu ,  Aaron S. Wallack ,  David J. Michael

    IPC分类号： G06K9/00 ,  G06K9/48 ,  H04N7/18

    CPC分类号： G06T7/0006 ,  G01N21/956 ,  G06T2207/30148 ,  H01L22/12

    摘要： An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.

    摘要翻译： 分析半导体互连焊盘的图像以确定多区域半导体互连焊盘的区域区域的几何描述。 边缘检测机视觉工具用于提取图像中的特征。 分析所提取的特征以得出在半导体器件检查，制造和组装操作中应用的焊盘区域的几何描述。

    Direct illumination machine vision technique for processing semiconductor wafers
    3.
    发明授权
    Direct illumination machine vision technique for processing semiconductor wafers 有权
    用于处理半导体晶片的直接照明机器视觉技术

    公开(公告)号：US08189194B2

    公开(公告)日：2012-05-29

    申请号：US12209248

    申请日：2008-09-12

    申请人： John W. Schwab ,  Gang Liu ,  David J. Michael ,  Lei Wang

    发明人： John W. Schwab ,  Gang Liu ,  David J. Michael ,  Lei Wang

    IPC分类号： G01B11/00

    CPC分类号： G03F9/00 ,  G03F9/7065 ,  G03F9/7084 ,  G03F9/7088

    摘要： A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.

    摘要翻译： 提供了一种视觉系统，用于确定压板上的半导体晶片与半导体晶片的远离压纸台的诸如印刷屏幕的处理机器上的元件之间的位置关系。 光源通过压板中的孔引导紫外光照射半导体晶片并将阴影投射到与半导体晶片的边缘相邻的元件上。 摄像机使用从压板孔接收的光产生图像，其中一些所接收的光被晶片反射。 图像中的半导体晶片的边缘由暗/光转变很好地限定。

    Method and apparatus for semiconductor wafer alignment
    4.
    发明授权
    Method and apparatus for semiconductor wafer alignment 有权
    用于半导体晶片对准的方法和装置

    公开(公告)号：US08162584B2

    公开(公告)日：2012-04-24

    申请号：US11508551

    申请日：2006-08-23

    申请人： David J. Michael ,  James Clark ,  Gang Liu

    发明人： David J. Michael ,  James Clark ,  Gang Liu

    IPC分类号： G06K9/00 ,  H01L21/677

    CPC分类号： H01L21/681 ,  G06T7/73

    摘要： The invention provides, in some aspects, a wafer alignment system comprising an image acquisition device, an illumination source, a rotatable wafer platform, and an image processor that includes functionality for mapping coordinates in an image of an article (such as a wafer) on the platform to a “world” frame of reference at each of a plurality of angles of rotation of the platform.

    摘要翻译： 本发明在一些方面提供了一种晶片对准系统，其包括图像获取装置，照明源，可旋转晶片平台和图像处理器，该图像处理器包括用于将物品（例如晶片）的图像中的坐标映射到 平台在平台的多个旋转角度的每一个处以“世界”参照系。

    DIRECT ILLUMINATION MACHINE VISION TECHNIQUE FOR PROCESSING SEMICONDUCTOR WAFERS
    7.
    发明申请
    DIRECT ILLUMINATION MACHINE VISION TECHNIQUE FOR PROCESSING SEMICONDUCTOR WAFERS 有权
    直接照明机器视觉技术处理半导体波形

    公开(公告)号：US20100065757A1

    公开(公告)日：2010-03-18

    申请号：US12209248

    申请日：2008-09-12

    申请人： John W. Schwab ,  Gang Liu ,  David J. Michael ,  Lei Wang

    发明人： John W. Schwab ,  Gang Liu ,  David J. Michael ,  Lei Wang

    IPC分类号： G01N23/00 ,  G01B11/00 ,  G02B27/30

    CPC分类号： G03F9/00 ,  G03F9/7065 ,  G03F9/7084 ,  G03F9/7088

    摘要： A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.

    摘要翻译： 提供了一种视觉系统，用于确定压板上的半导体晶片与半导体晶片的远离压纸台的诸如印刷屏幕的处理机器上的元件之间的位置关系。 光源通过压板中的孔引导紫外光照射半导体晶片并将阴影投射到与半导体晶片的边缘相邻的元件上。 摄像机使用从压板孔接收的光产生图像，其中一些所接收的光被晶片反射。 图像中的半导体晶片的边缘由暗/光转变很好地限定。

    Method and apparatus for determining a reference point of a bottle bottom in an image
    9.
    发明授权
    Method and apparatus for determining a reference point of a bottle bottom in an image 失效
    用于确定图像中瓶底参考点的方法和装置

    公开(公告)号：US06801649B1

    公开(公告)日：2004-10-05

    申请号：US09772751

    申请日：2001-01-30

    申请人： David J. Michael ,  Juha Koljonen ,  Paul Dutta-Choudhury

    发明人： David J. Michael ,  Juha Koljonen ,  Paul Dutta-Choudhury

    IPC分类号： G06K900

    CPC分类号： G06K9/3216 ,  G06K9/6203 ,  G06T7/30 ,  G06T7/60

    摘要： An efficient and reliable method and apparatus is disclosed that finds a reference point of an object profile within an image when the object is of an unknown size. The object profile is modeled using a synthetic labeled-projection model, which in conjunction with the image, is projected over a portion of the image of the object profile to derive a histogram. The histogram is normalized and a maximum of a first derivative of the histogram is defined for that position. The position of the labeled-projection model is moved relative to the image, and the process is repeated until a selected portion of the image has been examined. The first derivative of the normalized labeled projection is greatest when a feature of the image and the feature denoted by a specific synthetic label of the labeled-projection model are aligned. The method and apparatus can locate the center of the object with reliability, because use of the labeled-projection model and the histogram minimizes the * effects of image artifacts. Further, the method decreases computational time, and thus, increases performance speed.

    摘要翻译： 公开了一种有效且可靠的方法和装置，当物体具有未知尺寸时，找到图像内的对象轮廓的参考点。 使用合成的标注投影模型对对象轮廓进行建模，该模型与图像一起投影在对象轮廓的图像的一部分上以导出直方图。 对直方图进行归一化，并为该位置定义直方图的一阶导数的最大值。 标记投影模型的位置相对于图像移动，并重复该过程直到已经检查图像的所选部分。 当图像的特征和由标记投影模型的特定合成标签表示的特征对齐时，归一化标记投影的一阶导数最大。 该方法和装置可以可靠地定位对象的中心，因为使用标注投影模型和直方图可以最大限度地减小图像伪影的*效应。 此外，该方法减少了计算时间，从而提高了性能速度。

    Machine vision method using search models to find features in three dimensional images
    10.
    发明授权
    Machine vision method using search models to find features in three dimensional images 失效
    使用搜索模型的机器视觉方法来查找三维图像中的特征

    公开(公告)号：US06173070B2

    公开(公告)日：2001-01-09

    申请号：US09000583

    申请日：1997-12-30

    申请人： David J. Michael ,  Aaron S. Wallack

    发明人： David J. Michael ,  Aaron S. Wallack

    IPC分类号： G06K900

    CPC分类号： G06T7/001 ,  G06K9/00201 ,  G06T7/75 ,  G06T2200/04 ,  G06T2207/30152

    摘要： A system and method for analyzing 3D captured image data of scanned surfaces to locate object of interest, such as solder balls. A 3D model is created of an object of interest, the 3D model including weighted “don't care” areas where a match is not required. The 3D models which are used include geometric shapes, including a frustum, and models created from actual 3D image data of real objects. The 3D captured image data is processed to locate objects matching the 3D models, including processing by normalized correlation. Once the objects are located, the system selects data points within the 3D captured image data that are a predetermined distance away from the located objects. These data points are analyzed to determine a surface plane which fits the selected data points, thereby locating the surface in the 3D capture image data.

    摘要翻译： 一种用于分析扫描表面的3D拍摄图像数据以定位感兴趣对象（例如焊球）的系统和方法。 创建一个感兴趣对象的3D模型，3D模型包括不需要匹配的加权“无关”区域。 使用的3D模型包括几何形状，包括平截头体，以及由真实对象的实际3D图像数据创建的模型。 处理3D捕获的图像数据以定位与3D模型匹配的对象，包括通过归一化相关的处理。 一旦找到对象，系统就会选择距离定位对象一预定距离的3D捕获图像数据中的数据点。 分析这些数据点以确定适合所选数据点的表面，从而将表面定位在3D捕获图像数据中。