Invention Grant
- Patent Title: Transceiver and interface for IC package
- Patent Title (中): IC封装的收发器和接口
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Application No.: US13758464Application Date: 2013-02-04
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Publication No.: US08588562B2Publication Date: 2013-11-19
- Inventor: Eric Zbinden , Randall Musser , Jean-Marc André Verdiell , John Mongold , Brian Vicich , Keith Guetig
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: G02B6/12
- IPC: G02B6/12
Abstract:
An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.
Public/Granted literature
- US20130148973A1 TRANSCEIVER AND INTERFACE FOR IC PACKAGE Public/Granted day:2013-06-13
Information query
