Invention Grant
US08589832B2 On chip shielding structure for integrated circuits or devices on a substrate and method of shielding
有权
用于集成电路或基板上的器件的片上屏蔽结构和屏蔽方法
- Patent Title: On chip shielding structure for integrated circuits or devices on a substrate and method of shielding
- Patent Title (中): 用于集成电路或基板上的器件的片上屏蔽结构和屏蔽方法
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Application No.: US11844397Application Date: 2007-08-24
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Publication No.: US08589832B2Publication Date: 2013-11-19
- Inventor: Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Xuefeng Liu
- Applicant: Hanyi Ding , Kai D. Feng , Zhong-Xiang He , Xuefeng Liu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Anthony Canale
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
An electromagnetic shielding structure that includes a conductive structure surrounding and accommodating a circuit or a circuit device arranged on a substrate. At least one feed through device is associated with the conductive structure and provides signals to the circuit or circuit device. The method includes forming a shielding structure so that the shielding structure at least one of is at least partially arranged within the substrate and surrounds the circuit or circuit device and associating at least one feed through device with the shielding structure.
Public/Granted literature
- US20090052153A1 ON CHIP SHIELDING STRUCTURE FOR INTEGRATED CIRCUITS OR DEVICES ON A SUBSTRATE AND METHOD OF SHIELDING Public/Granted day:2009-02-26
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