Invention Grant
- Patent Title: Debondable adhesive article
- Patent Title (中): 脱粘胶制品
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Application No.: US12814553Application Date: 2010-06-14
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Publication No.: US08592034B2Publication Date: 2013-11-26
- Inventor: Joseph D. Rule , Kevin M. Lewandowski , Michael D. Determan
- Applicant: Joseph D. Rule , Kevin M. Lewandowski , Michael D. Determan
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Kent S. Kokko
- Main IPC: C09J7/02
- IPC: C09J7/02

Abstract:
An adhesive article is described that is debondable from substrates or adherends with the application of heat.
Public/Granted literature
- US20100316845A1 DEBONDABLE ADHESIVE ARTICLE Public/Granted day:2010-12-16
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