Invention Grant
- Patent Title: Sealing structure and method of manufacturing the same
- Patent Title (中): 密封结构及其制造方法
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Application No.: US12515590Application Date: 2007-11-15
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Publication No.: US08592228B2Publication Date: 2013-11-26
- Inventor: Johannes Donkers , Erwin Hijzen , Philippe Meunier-Beillard , Gerhard Koops
- Applicant: Johannes Donkers , Erwin Hijzen , Philippe Meunier-Beillard , Gerhard Koops
- Applicant Address: NL Eindhoven
- Assignee: NXP, B.V.
- Current Assignee: NXP, B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP06077143 20061120
- International Application: PCT/IB2007/054662 WO 20071115
- International Announcement: WO2008/062350 WO 20080529
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacturing a structure (1100), the method comprising forming a cap element (401) on a substrate (101), removing material (103) of the substrate (101) below the cap element (401) to thereby form a gap (802) between the cap element (401) and the substrate (101), and rearranging material of the cap element (401) and/or of the substrate (101) to thereby merge the cap element (401) and the substrate (101) to bridge the gap (802).
Public/Granted literature
- US20100052081A1 A SEALING STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-03-04
Information query
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