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US08592231B2 LED package structure and manufacturing method, and LED array module 有权
LED封装结构及制造方法，以及LED阵列模块

LED package structure and manufacturing method, and LED array module
摘要：
An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.
摘要（中）：

LED封装包括具有导电部分的基板和由导电部分的氧化物组成的非导电部分; 安装在所述导电部分上并电连接到所述导电部分的LED; 第一电极，设置在非导电部分上，并通过导线与LED电连接; 以及设置在所述基板上并电连接到所述LED的第二电极。

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