Invention Grant
- Patent Title: System for manufacturing laminated circuit boards
- Patent Title (中): 叠层电路板制造系统
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Application No.: US13247574Application Date: 2011-09-28
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Publication No.: US08594983B2Publication Date: 2013-11-26
- Inventor: Anthony Faraci , Gary N. Sortino
- Applicant: Anthony Faraci , Gary N. Sortino
- Applicant Address: US NY Islandia
- Assignee: Duetto Integrated Systems, Inc.
- Current Assignee: Duetto Integrated Systems, Inc.
- Current Assignee Address: US NY Islandia
- Agency: Lackenbach Siegel, LLP
- Agent Andrew F. Young, Esq.
- Main IPC: G06F7/60
- IPC: G06F7/60

Abstract:
The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.
Public/Granted literature
- US20120174387A1 SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS Public/Granted day:2012-07-12
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