SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS
    1.
    发明申请
    SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS 有权
    制造层压电路板的系统

    公开(公告)号:US20120174387A1

    公开(公告)日:2012-07-12

    申请号:US13247574

    申请日:2011-09-28

    Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

    Abstract translation: 本发明涉及一种无针对配准和感应加热系统,其涉及使用用于对层压元件的初始位置进行成像的预对准工位,成像和计算机操作控制系统,用于确定所需的校正因子, 预对准工位的叠层元件以及用于层压元件的优选堆叠方向,以及用于使用优选的四层结构将层压元件从顶部位置牢固地夹紧,转移和重新定位到优选堆叠方向的对准和传送系统, 轴方向。

    SYSTEM FOR MANUFACTURING LAMINTED CIRCUIT BOARDS
    3.
    发明申请
    SYSTEM FOR MANUFACTURING LAMINTED CIRCUIT BOARDS 有权
    用于制造层压电路板的系统

    公开(公告)号:US20140034244A1

    公开(公告)日:2014-02-06

    申请号:US14047183

    申请日:2013-10-07

    Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from atop position to the preferred stack orientation employing a preferred four-axis orientation.

    Abstract translation: 本发明涉及一种无针对配准和感应加热系统,其涉及使用用于对层压元件的初始位置进行成像的预对准工位,成像和计算机操作控制系统,用于确定所需的校正因子, 预对准工位的层压元件和用于层压元件的优选堆叠方向,以及用于使用优选的四轴线将层压元件从顶部位置牢固地夹持,转移和重新定位到优选堆叠取向的对准和传送系统 方向。

    System for manufacturing laminated circuit boards
    4.
    发明授权
    System for manufacturing laminated circuit boards 有权
    叠层电路板制造系统

    公开(公告)号:US08594983B2

    公开(公告)日:2013-11-26

    申请号:US13247574

    申请日:2011-09-28

    Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

    Abstract translation: 本发明涉及一种无针对配准和感应加热系统,其涉及使用用于对层压元件的初始位置进行成像的预对准工位,成像和计算机操作控制系统,用于确定所需的校正因子, 预对准工位的叠层元件以及用于层压元件的优选堆叠方向,以及用于使用优选的四层结构将层压元件从顶部位置牢固地夹紧,转移和重新定位到优选堆叠方向的对准和传送系统, 轴方向。

    SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS
    5.
    发明申请
    SYSTEM FOR MANUFACTURING LAMINATED CIRCUIT BOARDS 有权
    制造层压电路板的系统

    公开(公告)号:US20140332162A1

    公开(公告)日:2014-11-13

    申请号:US14341901

    申请日:2014-07-28

    Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

    Abstract translation: 本发明涉及一种无针对配准和感应加热系统,其涉及使用用于对层压元件的初始位置进行成像的预对准工位,成像和计算机操作控制系统,用于确定所需的校正因子, 预对准工位的叠层元件以及用于层压元件的优选堆叠方向,以及用于使用优选的四层结构将层压元件从顶部位置牢固地夹紧,转移和重新定位到优选堆叠方向的对准和传送系统, 轴方向。

    BOND HEAD ASSEMBLY AND SYSTEM
    6.
    发明申请

    公开(公告)号:US20100212945A1

    公开(公告)日:2010-08-26

    申请号:US12377268

    申请日:2007-08-30

    Abstract: An inductive thermal bonding system includes at least one inductive bonding or heating member containing a magnetic E-shaped inductive core and a coil bounding a central member of the E-shaped inductive core. A rigid cover plate allows high and predictable temperature rate-of-change during use and reduced thermal cycling time without risk of detriment. Adaptive solid copper pads on multiplayer bonding regions minimize bonding errors and improve reliability. A cooling system is provided for adaptively cooling both the bond head and the bonded stack. Single and paired inductive heating members may be employed, and may also be alternatively controlled and positioned to aid generation of multiplayer bonding subassemblies distant from an edge of a multiplayer sheet construct.

    Abstract translation: 感应热粘合系统包括至少一个感应接合或加热构件,其包含磁性E形感应芯和限定E形感应芯的中心构件的线圈。 刚性盖板在使用期间允许高且可预测的温度变化率,并且减少热循环时间而没有损害的风险。 多功能键合区域上的自适应实心铜焊盘可减少接合误差并提高可靠性。 提供了冷却系统,用于自适应地冷却粘结头和粘合层叠体。 可以采用单个和成对的感应加热构件,并且还可以选择性地控制和定位以帮助产生远离多层板结构的边缘的多层结合子组件。

    SYSTEM AND METHOD FOR MANUFACTURING LAMINATED CIRCUIT BOARDS
    7.
    发明申请
    SYSTEM AND METHOD FOR MANUFACTURING LAMINATED CIRCUIT BOARDS 有权
    用于制造层压电路板的系统和方法

    公开(公告)号:US20100058584A1

    公开(公告)日:2010-03-11

    申请号:US12208972

    申请日:2008-09-11

    Abstract: The present invention relates to a pin-less registration and inductive heating system involving the use of a pre-alignment station for imaging an initial position of a laminate element, an imaging and computer operation control system for determining a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element, and an alignment and transfer system for securely gripping, transferring, and repositioning a laminate element from a top position to the preferred stack orientation employing a preferred four-axis orientation.

    Abstract translation: 本发明涉及一种无针对配准和感应加热系统,其涉及使用用于对层压元件的初始位置进行成像的预对准工位,成像和计算机操作控制系统,用于确定所需的校正因子, 预对准工位的叠层元件以及用于层压元件的优选堆叠方向,以及用于使用优选的四层结构将层压元件从顶部位置牢固地夹紧,转移和重新定位到优选堆叠方向的对准和传送系统, 轴方向。

    Method for pin-less registration of a plurality of laminate elements
    8.
    发明授权
    Method for pin-less registration of a plurality of laminate elements 有权
    多个层压元件无针对配准的方法

    公开(公告)号:US08065121B2

    公开(公告)日:2011-11-22

    申请号:US12208972

    申请日:2008-09-11

    Abstract: The present invention relates to a pin-less registration method for a plurality of laminate elements in a selected stack orientation. The method involves the use of an optical step that images portions of each laminate and determines a required correction factor between an alignment of the laminate element at the pre-alignment station and a preferred stack orientation for the laminate element. A computer operation control system provides instructions for positioning laminate elements to a corrected stack orientation during an assembly of the stack. Following the assembly of the stack an induction welding step occurs at predetermined locations to secure the pinless alignment.

    Abstract translation: 本发明涉及一种在选定的堆叠取向中的多个层叠元件的无针注册方法。 该方法包括使用光学步骤,其对每个层叠体的部分进行成像,并且确定层压元件在预对准工位的对准和层压元件的优选堆叠取向之间所需的校正因子。 计算机操作控制系统提供了在堆叠的组装期间将层压元件定位到校正的堆叠取向的指令。 在组装堆叠之后,感应焊接步骤发生在预定位置以固定无PIN对准。

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