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Invention Grant
US08597081B2 Chemical mechanical polishing apparatus having pad conditioning disk and pre-conditioner unit 有权
化学机械抛光装置具有衬垫调节盘和预调节单元

Chemical mechanical polishing apparatus having pad conditioning disk and pre-conditioner unit
Abstract:
A pad conditioning disk, a pre-conditioning unit, and a CMP apparatus having the same are provided. The pad conditioning disk includes a base in which mountain-type tips and valley-type grooves are repeatedly connected to each other, and a cutting layer formed on the base layer. The cutting layer including conditioning particles deposited on surfaces of the tips and grooves. A surfaces roughness of conditioning particles deposited on the surfaces of the tips is less than a surface roughness of conditioning particles deposited on the surfaces of the grooves.
Abstract(Chinese):

提供了衬垫调节盘，预调节单元和具有该调节盘的CMP设备。 垫调节盘包括其中山型尖端和谷型沟槽彼此重复连接的基底和形成在基底层上的切割层。 切割层包括沉积在尖端和凹槽表面上的调节颗粒。 沉积在尖端表面上的调理颗粒的表面粗糙度小于沉积在凹槽表面上的调理颗粒的表面粗糙度。

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