发明授权
- 专利标题： Methods of fabricating electronics assemblies
- 专利标题（中）： 制造电子组件的方法
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申请号： US13285547申请日： 2011-10-31
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公开(公告)号： US08597982B2公开(公告)日： 2013-12-03
- 发明人: David K. Foote , James D. Getty , Jiangang Zhao
- 申请人： David K. Foote , James D. Getty , Jiangang Zhao
- 申请人地址： US OH Westlake
- 专利权人： Nordson Corporation
- 当前专利权人： Nordson Corporation
- 当前专利权人地址： US OH Westlake
- 代理机构： Wood, Herron & Evans LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
In an embodiment of the present invention, a method is provided for fabricating an electronics assembly having a substrate and a plurality of circuit elements. The method includes forming a liquid barrier on the substrate, placing a first circuit element on one side of the liquid barrier, and placing a second circuit element on the opposite side of the liquid barrier. A liquid is applied to the first circuit element. The method further includes using the liquid barrier to prevent the liquid applied to the first circuit element from contaminating the second circuit element so that the spacing between the first and second circuit elements can be minimized.
公开/授权文献
- US20130109136A1 METHODS OF FABRICATING ELECTRONICS ASSEMBLIES 公开/授权日：2013-05-02
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