Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13324306Application Date: 2011-12-13
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Publication No.: US08598622B2Publication Date: 2013-12-03
- Inventor: Koji Sadamatsu , Ze Chen , Katsumi Nakamura
- Applicant: Koji Sadamatsu , Ze Chen , Katsumi Nakamura
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-098360 20110426
- Main IPC: H01L29/74
- IPC: H01L29/74 ; H01L31/111

Abstract:
A semiconductor device includes: a transistor region including an IGBT having a gate electrode and an emitter electrode; a termination region placed around the transistor region; and an extraction region placed between the transistor and the termination region and extracting redundant carriers. A P-type layer is placed on an N-type drift layer in the extraction region. The P-type layer is connected to the emitter electrode. A dummy gate electrode is placed via an insulation film on the P-type layer. The dummy gate electrode is connected to the gate electrode. Life time of carriers in the termination region is shorter than life time of carriers in the transistor region and the extraction region.
Public/Granted literature
- US20120273836A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-11-01
Information query
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