Pins on an RFIC package carry RF signals between the package and a PCB. A first capacitor is coupled between a selected pin of the RFIC package near the pins carrying the RF signals and a radio-frequency ground on the PCB. A coupling between the RFIC package and the PCB is modeled, and includes modeling of the pins of interest and at least one parasitic element of the coupling. A capacitance of the first capacitor is selected based on the modeling to obtain desired performance at selected operational frequencies. A second capacitor may be coupled between the selected pin a radio frequency ground of the RFIC package. An inductor may be coupled in parallel across the first capacitor.