Invention Grant
- Patent Title: Uplink open loop power control system
- Patent Title (中): 上行开环电源控制系统
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Application No.: US12638707Application Date: 2009-12-15
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Publication No.: US08599769B2Publication Date: 2013-12-03
- Inventor: Rongzhen Yang , Wei Guan , Apostolos Papathanassiou , Hujun Yin , Yang-Seok Choi , Yi Hsuan
- Applicant: Rongzhen Yang , Wei Guan , Apostolos Papathanassiou , Hujun Yin , Yang-Seok Choi , Yi Hsuan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H04W4/00
- IPC: H04W4/00
Abstract:
Embodiments of the present invention provide an uplink open loop power control system in which interference over thermal information is transmitted to mobile stations. Other embodiments may be described and claimed.
Public/Granted literature
- US20110002279A1 UPLINK OPEN LOOP POWER CONTROL SYSTEM Public/Granted day:2011-01-06
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