发明授权
US08603635B2 Flexible, molded or extruded articles and semiconductive compounds for their manufacture
有权
用于制造的柔性,模制或挤压制品和半导体化合物
- 专利标题: Flexible, molded or extruded articles and semiconductive compounds for their manufacture
- 专利标题(中): 用于制造的柔性,模制或挤压制品和半导体化合物
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申请号: US13496532申请日: 2010-09-08
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公开(公告)号: US08603635B2公开(公告)日: 2013-12-10
- 发明人: Mohamed Esseghir , Jeffrey M. Cogen
- 申请人: Mohamed Esseghir , Jeffrey M. Cogen
- 申请人地址: US MI Midland
- 专利权人: Union Carbide Chemicals & Plastics Technology LLC
- 当前专利权人: Union Carbide Chemicals & Plastics Technology LLC
- 当前专利权人地址: US MI Midland
- 代理机构: Whyte Hirschboeck Dudek S.C.
- 国际申请: PCT/US2010/048075 WO 20100908
- 国际公布: WO2011/037747 WO 20110331
- 主分类号: B32B27/40
- IPC分类号: B32B27/40 ; B32B1/24 ; B32B27/00 ; B32B9/04 ; B32B15/08
摘要:
A molded or extruded article, e.g., an electrical part or shielded cable, comprises at least one insulation layer and at least one semiconductive layer, the semiconductive layer thick and comprising in weight percent: A. 1 to 30 wt % of conductive filler; B. 10 to 90 wt % of a non-olefin elastomer; C. 10 to 90 wt % of an olefin elastomer; and D. Optionally, 0.5 to 2.5 wt % of peroxide. Carbon black and/or metal particulates or powder typically comprise the filler, silicone or urethane rubber the non-olefin elastomer, and EPR or EPDM the olefin elastomer.
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