Invention Grant
US08604354B2 Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board
失效
印刷电路板，印刷电路板的制造方法以及印刷电路板的连接方法
- Patent Title: Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board
- Patent Title (中): 印刷电路板，印刷电路板的制造方法以及印刷电路板的连接方法
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Application No.: US12645191Application Date: 2009-12-22
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Publication No.: US08604354B2Publication Date: 2013-12-10
- Inventor: Shoji Ito , Tomofumi Kitada , Tadanori Ominato
- Applicant: Shoji Ito , Tomofumi Kitada , Tadanori Ominato
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-332676 20081226
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.
Public/Granted literature
Information query
