公开(公告)号：US08604354B2

公开(公告)日：2013-12-10

申请号：US12645191

申请日：2009-12-22

Applicant: Shoji Ito ,  Tomofumi Kitada ,  Tadanori Ominato

Inventor： Shoji Ito ,  Tomofumi Kitada ,  Tadanori Ominato

IPC: H05K1/02

CPC classification number: H05K3/4015 ,  B29C65/48 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8322 ,  B29K2027/18 ,  B29K2063/00 ,  B29K2077/10 ,  B29K2079/08 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0005 ,  B29L2009/003 ,  B29L2031/3425 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/281 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1189 ,  Y10T156/10

Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

Abstract translation: 一种印刷线路板，包括：绝缘基板; 设置在该绝缘基板一侧的导电电路; 覆盖绝缘基板和导电电路的覆盖层; 以及埋置在该覆盖层中的导电性粒子，其中，导电粒子被掩埋在覆盖层中，使得导电粒子与导电电路接触并从覆盖层突出; 并且导电粒子用作电接触点。

公开(公告)号：US20100163289A1

公开(公告)日：2010-07-01

申请号：US12645191

申请日：2009-12-22

Applicant: Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

Inventor： Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

IPC: H05K1/02 ,  B29C65/00 ,  B29C65/48 ,  H05K1/11

CPC classification number: H05K3/4015 ,  B29C65/48 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8322 ,  B29K2027/18 ,  B29K2063/00 ,  B29K2077/10 ,  B29K2079/08 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0005 ,  B29L2009/003 ,  B29L2031/3425 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/281 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1189 ,  Y10T156/10

Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

Abstract translation: 一种印刷线路板，包括：绝缘基板; 设置在该绝缘基板一侧的导电电路; 覆盖绝缘基板和导电电路的覆盖层; 以及埋置在该覆盖层中的导电性粒子，其中，导电粒子被掩埋在覆盖层中，使得导电粒子与导电电路接触并从覆盖层突出; 并且导电粒子用作电接触点。

公开(公告)号：US06387734B1

公开(公告)日：2002-05-14

申请号：US09762681

申请日：2001-05-24

Applicant: Masatoshi Inaba ,  Takanao Suzuki ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka

Inventor： Masatoshi Inaba ,  Takanao Suzuki ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka

IPC: H01L2144

CPC classification number: H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00

Abstract: An insulating layer (3) is formed on a Si wafer (1). An opening portion is made in this insulating layer (3), and subsequently a rerouting layer (2) is formed. Next, a resin layer (4) is formed on the rerouting layer (2). The resin layer (4) is then cured so that the rerouting layer (2) and a Cu foil (5) are bonded to each other through the resin layer (4). Thereafter, a ring-like opening portion (4a) is made in the resin layer (4), and a Cu plating layer (8) is formed inside this opening portion (4a).

Abstract translation: 在Si晶片（1）上形成绝缘层（3）。 在该绝缘层（3）中形成开口部，随后形成重路由层（2）。 接着，在重路由层（2）上形成树脂层（4）。 然后使树脂层（4）固化，使得重新布线层（2）和Cu箔（5）通过树脂层（4）彼此接合。 之后，在树脂层（4）中形成有环状的开口部（4a），在该开口部（4a）的内部形成有Cu镀层（8）。

公开(公告)号：US07023088B2

公开(公告)日：2006-04-04

申请号：US10442298

申请日：2003-05-21

Applicant: Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

Inventor： Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract translation: 形成在与电极焊盘（2）相适应的位置处具有开口部（3a）的绝缘层（3）。 接着，在绝缘层（3）上形成树脂突起部（4）。 此后，形成抗蚀剂膜，该抗蚀剂膜具有在与开口部分（31a）相适应的区域中形成的开口部分，树脂突出部分（4）和夹在其间的区域。 通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

公开(公告)号：US20050037539A1

公开(公告)日：2005-02-17

申请号：US10949386

申请日：2004-09-27

Applicant: Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

Inventor： Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/485 ,  H01L23/525 ,  H01L21/44

CPC classification number: H01L24/10 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract translation: 形成在与电极焊盘（2）一致的位置具有开口部（3a）的绝缘层（3）。 接着，在绝缘层（3）上形成树脂突起部（4）。 此后，形成抗蚀剂膜，其具有在与开口部分（3a），树脂突出部分（4）和夹在其间的区域相适应的区域中形成的开口部分。 通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

公开(公告)号：US07205491B2

公开(公告)日：2007-04-17

申请号：US10527399

申请日：2003-09-11

Applicant: Masahiro Kaizu ,  Tadanori Ominato ,  Koji Hirai

Inventor： Masahiro Kaizu ,  Tadanori Ominato ,  Koji Hirai

IPC: H01H9/26

CPC classification number: H01H13/702 ,  H01H13/48 ,  H01H2203/054 ,  H01H2205/018 ,  H01H2215/036

Abstract: The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.

Abstract translation: 本发明提供一种能够获得良好的咔嗒感并能够避免接触不良并具有高耐久性的钥匙开关隔膜。 钥匙开关隔膜30包括具有柔性和导电性的薄板，并且钥匙开关隔膜30包括截头基座16和朝向基座16的上部的上侧部分的凸起部分18上升的球形圆顶部分18 基座16。 圆顶部分18设置在其基本上中心部分处，向外的凸起部分32朝向顶部18的外表面升高。 在其内表面侧上的向外凸起部分32的边缘形成触点34。

公开(公告)号：US06835595B1

公开(公告)日：2004-12-28

申请号：US09744976

申请日：2001-06-04

Applicant: Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

Inventor： Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

IPC: H01L2144

CPC classification number: H01L24/10 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract translation: 形成在与电极焊盘（2）一致的位置具有开口部（3a）的绝缘层（3）。 接着，在绝缘层（3）上形成树脂突起部（4）。 此后，形成抗蚀剂膜，其具有在与开口部分（3a），树脂突出部分（4）和夹在其间的区域相适应的区域中形成的开口部分。 通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

公开(公告)号：US07157363B2

公开(公告)日：2007-01-02

申请号：US10949386

申请日：2004-09-27

Applicant: Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

Inventor： Takanao Suzuki ,  Masatoshi Inaba ,  Tadanori Ominato ,  Masahiro Kaizu ,  Akihito Kurosaka ,  Masatoshi Inaba ,  Nobuyuki Sadakata ,  Mutsumi Masumoto ,  Kenji Masumoto

IPC: H01L21/44

CPC classification number: H01L24/10 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0231 ,  H01L2224/02351 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.

Abstract translation: 形成在与电极焊盘（2）相适应的位置处具有开口部（3a）的绝缘层（3）。 接着，在绝缘层（3）上形成树脂突起部（4）。 此后，形成抗蚀剂膜，该抗蚀剂膜具有在与开口部分（31a）相适应的区域中形成的开口部分，树脂突出部分（4）和夹在其间的区域。 通过使用抗蚀剂膜作为掩模，通过电解铜电镀形成Cu镀层（6）。

公开(公告)号：US20060016679A1

公开(公告)日：2006-01-26

申请号：US10527399

申请日：2003-09-11

Applicant: Masahiro Kaizu ,  Tadanori Ominato ,  Koji Hirai

Inventor： Masahiro Kaizu ,  Tadanori Ominato ,  Koji Hirai

IPC: H01H5/18

CPC classification number: H01H13/702 ,  H01H13/48 ,  H01H2203/054 ,  H01H2205/018 ,  H01H2215/036

Abstract: The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.

Abstract translation: 本发明提供一种能够获得良好的咔嗒感并能够避免接触不良并具有高耐久性的钥匙开关隔膜。 钥匙开关隔膜30包括具有柔性和导电性的薄板，并且钥匙开关隔膜30包括截头基座16和朝向基座16的上部的上侧部分的凸起部分18上升的球形圆顶部分18 基座16。 圆顶部分18设置在其基本上中心部分处，向外的凸起部分32朝向顶部18的外表面升高。 在其内表面侧上的向外凸起部分32的边缘形成触点34。