Invention Grant
US08604357B2 Wiring board having via and method forming a via in a wiring board
失效
具有通孔的布线板和在布线板中形成通孔的方法
- Patent Title: Wiring board having via and method forming a via in a wiring board
- Patent Title (中): 具有通孔的布线板和在布线板中形成通孔的方法
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Application No.: US12501044Application Date: 2009-07-10
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Publication No.: US08604357B2Publication Date: 2013-12-10
- Inventor: Tsutomu Takeda
- Applicant: Tsutomu Takeda
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2008-183665 20080715
- Main IPC: H05K3/42
- IPC: H05K3/42 ; H05K3/30 ; H05K1/11
Abstract:
A wiring board has a plurality of wiring layers, a first land, a second land, a first via and a second via. The first land and the second land are formed on at least one wiring layer of the wiring board and are disposed to partially overlap with each other. The first via and the second via are formed in association with the first land and the second land, respectively. The first via and the second via electrically connect a first wiring layer and a second wiring layer of the plurality of wiring layers to each other. The wiring board has a separator that is formed by a hole that separates the first land and the second land from each other.
Public/Granted literature
- US20100012366A1 WIRING BOARD HAVING VIA AND METHOD FORMING A VIA IN A WIRING BOARD Public/Granted day:2010-01-21
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