Invention Grant
US08607447B2 Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas
有权
用于提供和连接半导体部件或基板的两个接触区域的方法以及具有两个这样连接的接触区域的基板
- Patent Title: Method for providing and connecting two contact areas of a semiconductor component or a substrate, and a substrate having two such connected contact areas
- Patent Title (中): 用于提供和连接半导体部件或基板的两个接触区域的方法以及具有两个这样连接的接触区域的基板
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Application No.: US13004427Application Date: 2011-01-11
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Publication No.: US08607447B2Publication Date: 2013-12-17
- Inventor: Jochen Reinmuth , Heribert Weber
- Applicant: Jochen Reinmuth , Heribert Weber
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102010000892 20100114
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L21/768
Abstract:
A method for providing and connecting a first contact area to at least one second contact area on a substrate, in particular in the case of a semiconductor component, which includes providing at least one insulation layer on the substrate, forming an opening in the at least one insulation layer over at least one insulation trench of a first contact area, applying at least one metal layer to the insulation layer, forming the first and second contact areas in the at least one metal layer and at least one printed conductor between the two contact areas, and forming the insulation trench.
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