Invention Grant
- Patent Title: Softening point measuring apparatus and thermal conductivity measuring apparatus
- Patent Title (中): 软化点测量仪和热导率测量仪
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Application No.: US12806364Application Date: 2010-08-11
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Publication No.: US08608373B2Publication Date: 2013-12-17
- Inventor: Kazunori Ando , Masayuki Iwasa , Masatsugu Shigeno , Hiroumi Momota , Kazutoshi Watanabe
- Applicant: Kazunori Ando , Masayuki Iwasa , Masatsugu Shigeno , Hiroumi Momota , Kazutoshi Watanabe
- Applicant Address: JP
- Assignee: SII NanoTechnology Inc.
- Current Assignee: SII NanoTechnology Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2009-187479 20090812
- Main IPC: G01N25/02
- IPC: G01N25/02 ; G01N25/18

Abstract:
In a local softening point measuring apparatus and thermal conductivity measuring apparatus using a probe microscope as a base, environment of the prob˜ and a sample surface is set to 1/100 atmospheric pressure (103 Pa) or lower. Otherwise, a side surface of the probe is coated with a thermal insulation material having a thickness that enables thermal dissipation to be reduced to 1/100 or lower, to thereby reduce the thermal dissipation from the side surface of the probe, and exchange heat substantially only at the contacting portion between the probe and the sample surface.
Public/Granted literature
- US20110038392A1 Softening point measuring apparatus and thermal conductivity measuring apparatus Public/Granted day:2011-02-17
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