Invention Grant
US08608373B2 Softening point measuring apparatus and thermal conductivity measuring apparatus 有权
软化点测量仪和热导率测量仪

Softening point measuring apparatus and thermal conductivity measuring apparatus
Abstract:
In a local softening point measuring apparatus and thermal conductivity measuring apparatus using a probe microscope as a base, environment of the prob˜ and a sample surface is set to 1/100 atmospheric pressure (103 Pa) or lower. Otherwise, a side surface of the probe is coated with a thermal insulation material having a thickness that enables thermal dissipation to be reduced to 1/100 or lower, to thereby reduce the thermal dissipation from the side surface of the probe, and exchange heat substantially only at the contacting portion between the probe and the sample surface.
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