Invention Grant
- Patent Title: Photosensitive integrated circuit equipped with a reflective layer and corresponding method of production
- Patent Title (中): 光敏集成电路配有反射层和相应的生产方法
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Application No.: US13241111Application Date: 2011-09-22
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Publication No.: US08610048B2Publication Date: 2013-12-17
- Inventor: Jerome Alieu , Simon Guillaumet , Christophe Legendre , Hughes Leininger , Jean-Pierre Oddou , Marc Vincent
- Applicant: Jerome Alieu , Simon Guillaumet , Christophe Legendre , Hughes Leininger , Jean-Pierre Oddou , Marc Vincent
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics S.A.
- Current Assignee: STMicroelectronics S.A.
- Current Assignee Address: FR Montrouge
- Agency: Graybeal Jackson LLP
- Priority: FR0511755 20051121
- Main IPC: H01J3/14
- IPC: H01J3/14 ; H01J5/16

Abstract:
A method for producing a photosensitive integrated circuit including producing circuit control transistors, producing, above the control transistors, and between at least one upper electrode and at least one lower electrode, at least one photodiode, by amorphous silicon layers into which photons from incident electromagnetic radiation are absorbed, producing at least one passivation layer, between the lower electrode and the control transistors, and producing, between the control transistors and the external surface of the integrated circuit, a reflective layer capable of reflecting photons not absorbed by the amorphous silicon layers.
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