Invention Grant
US08623169B2 Adhesive system for the direct bonding of a cured polyurethane to crude rubber
有权
用于将固化的聚氨酯直接粘合到粗橡胶上的粘合剂系统
- Patent Title: Adhesive system for the direct bonding of a cured polyurethane to crude rubber
- Patent Title (中): 用于将固化的聚氨酯直接粘合到粗橡胶上的粘合剂系统
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Application No.: US13489194Application Date: 2012-06-05
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Publication No.: US08623169B2Publication Date: 2014-01-07
- Inventor: Antonio Delfino , Philippe Chenaux , Corinne Deforel
- Applicant: Antonio Delfino , Philippe Chenaux , Corinne Deforel
- Applicant Address: CH Givisiez
- Assignee: Conception et Developpement Michelin S.A.
- Current Assignee: Conception et Developpement Michelin S.A.
- Current Assignee Address: CH Givisiez
- Agency: Cozen O'Connor
- Priority: FR0407666 20040707
- Main IPC: C08K5/01
- IPC: C08K5/01 ; C08K3/34 ; C08L91/08 ; C08L95/00 ; C04B37/00 ; B41J2/16 ; B32B7/12

Abstract:
Adhesive composition usable in particular as an adhesion primer, based on a polyisocyanate compound and a polyester or vinyl ester resin comprising (in particular hydroxyl) functional groups which are reactive towards isocyanate groups of said polyisocyanate, the total number of said isocyanate groups being in excess relative to the total number of said functional groups of the polyester or vinyl ester resin. The polyisocyanate compound is preferably a diisocyanate, the resin is preferably an epoxy vinyl ester resin, in particular novolac- and/or bisphenol-based. Said composition is usable, as an adhesion primer, in combination with a secondary adhesion layer preferably based on a polyvinylpyridine/stirene/butadiene elastomer and a polyester or vinyl ester resin. Use of such an adhesive system for bonding a cured polyurethane to an uncured diene elastomer composition, in particular in the manufacture of rubber articles consisting of ground contact systems for motor vehicles, in particular pneumatic or non-pneumatic tires.
Public/Granted literature
- US20130000841A1 Adhesive System for the Direct Bonding of a Cured Polyurethane to Crude Rubber Public/Granted day:2013-01-03
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