发明授权
US08626480B2 Compact model for device/circuit/chip leakage current (IDDQ) calculation including process induced uplift factors 失效
紧凑型器件/电路/芯片泄漏电流(IDDQ)计算,包括工艺引起的隆起因素

Compact model for device/circuit/chip leakage current (IDDQ) calculation including process induced uplift factors
摘要:
A system, method and computer program product for implementing a quiescent current leakage specific model into semiconductor device design and circuit design flows. The leakage model covers all device geometries with wide temperature and voltage ranges and, without the need for stacking factor calculations nor spread sheet based IDDQ calculations. The leakage model for IDDQ calculation incorporates further parasitic and proximity effects. The leakage model implements leakage calculations at different levels of testing, e.g., from a single device to a full chip design, and are integrated within one single model. The leakage model implements leakage calculations at different levels of testing with the leverage of a single switch setting. The implementation is via a hardware definition language code or object oriented code that can be compiled and operated using a netlist of interest, e.g., for conducting a performance analysis.
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